multicomp PRO Thermal Conductive Tape, Acrylic Polymer; Thermal Conductivity Multicomp Pro MP700388

Description
THERMAL CONDUCTIVE TAPE, ACRYLIC POLYMER; Thermal Conductivity:0.6W/m. K; Conductive Material:Acrylic Polymer; Thickness:0.125mm; Thermal Impedance:-; Dielectric Strength:26kV/mm; External Length:4.57m; External Width:19.05mm RoHS Compliant: NA
  • Thermal Conductive Tape, Acrylic Polymer; Thermal Conductivity Multicomp Pro - 77AH0530 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
THERMAL CONDUCTIVE TAPE, ACRYLIC POLYMER; Thermal Conductivity:0.6W/m. K; Conductive Material:Acrylic Polymer; Thickness:0.125mm; Thermal Impedance:-; Dielectric Strength:26kV/mm; External Length:4.57m; External Width:19.05mm RoHS Compliant: NA
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Conductive Tape, Acrylic Polymer; Thermal Conductivity Multicomp Pro - 77AH0530 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Conductive Tape, Acrylic Polymer; Thermal Conductivity Multicomp Pro
77AH0530
Thermal Conductive Tape, Acrylic Polymer; Thermal Conductivity Multicomp Pro 77AH0530
THERMAL CONDUCTIVE TAPE, ACRYLIC POLYMER; Thermal Conductivity:0.6W/m. K; Conductive Material:Acrylic Polymer; Thickness:0.125mm; Thermal Impedance:-; Dielectric Strength:26kV/mm; External Length:4.57m; External Width:19.05mm RoHS Compliant: NA

THERMAL CONDUCTIVE TAPE, ACRYLIC POLYMER; Thermal Conductivity:0.6W/m.K; Conductive Material:Acrylic Polymer; Thickness:0.125mm; Thermal Impedance:-; Dielectric Strength:26kV/mm; External Length:4.57m; External Width:19.05mm RoHS Compliant: NA

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 77AH0530
Product Name Thermal Conductive Tape, Acrylic Polymer; Thermal Conductivity Multicomp Pro
Thermal Conductivity 0.6000 W/m-K (0.3467 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed - QSil-553 - CHT USA Inc.
CHT USA Inc.
2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed
QSil-553
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics; OEM or Industrial
Features Flame Retardant; UL Rating
View Details
Thermal conductive non-silicone gap filler thermal pad for heatsink - AF500 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Thermal conductive non-silicone gap filler thermal pad for heatsink
AF500
Specs
Form / Shape Pad
Chemical System Silicone
Industry Electronics
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Thin Flim, General Purpose with 0.05mm Glass Cloth Reinforcement - SARCON ® GTR - Fujipoly® America Corp.
Fujipoly® America Corp.
Thin Flim, General Purpose with 0.05mm Glass Cloth Reinforcement
SARCON ® GTR
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Gap Fill 0.0059 to 0.0118 inch (0.1500 to 0.3000 mm)
Industry Electronics; Semiconductors, IC's
View Details