multicomp PRO Thermal Interface Pad, 150Mm X 100Mm X 2Mm Rohs Compliant Multicomp Pro MP008845

Description
THERMAL INTERFACE PAD, 150Mm x 100Mm x 2MM ROHS COMPLIANT: YES
  • Thermal Interface Pad, 150Mm X 100Mm X 2Mm Rohs Compliant Multicomp Pro - 25AK3596 - Newark, An Avnet Company
    Newark, An Avnet Company
Description
THERMAL INTERFACE PAD, 150Mm x 100Mm x 2MM ROHS COMPLIANT: YES

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Pad, 150Mm X 100Mm X 2Mm Rohs Compliant Multicomp Pro - 25AK3596 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Pad, 150Mm X 100Mm X 2Mm Rohs Compliant Multicomp Pro
25AK3596
Thermal Interface Pad, 150Mm X 100Mm X 2Mm Rohs Compliant Multicomp Pro 25AK3596
THERMAL INTERFACE PAD, 150Mm x 100Mm x 2MM ROHS COMPLIANT: YES

THERMAL INTERFACE PAD, 150Mm x 100Mm x 2MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 25AK3596
Product Name Thermal Interface Pad, 150Mm X 100Mm X 2Mm Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Highly Thermally Conductive and Non-Flammable Interface Material - SARCON ® XR-Pe - Fujipoly® America Corp.
Fujipoly® America Corp.
Highly Thermally Conductive and Non-Flammable Interface Material
SARCON ® XR-Pe
Specs
Form / Shape Putty; Gap Filler, Foam in Place Gasket
Chemical System Silicone
Gap Fill 0.0394 to 0.0787 inch (1 to 2 mm)
View Details
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D - 746D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D
746D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Chemical System Silicone
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Ultra-high thermal conductivity thermal gel - SE50 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Ultra-high thermal conductivity thermal gel
SE50
Specs
Form / Shape Gel
Chemical System Silicone
Industry Electronics
View Details
Advanced Conductive Die Attach for Semiconductors - ATROX ® 558-2C31 - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Advanced Conductive Die Attach for Semiconductors
ATROX ® 558-2C31
Specs
Cure / Technology Thermoset
Form / Shape Die Bonding Adhesives; Grease, Paste
Industry Electronics; Semiconductors, IC's
View Details