multicomp PRO Thermal Interface Pad, 150Mm X 50Mm X 0.5Mm Rohs Compliant Multicomp Pro MP008839

Description
THERMAL INTERFACE PAD, 150Mm x 50Mm x 0.5MM ROHS COMPLIANT: YES
Description
THERMAL INTERFACE PAD, 150Mm x 50Mm x 0.5MM ROHS COMPLIANT: YES

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Pad, 150Mm X 50Mm X 0.5Mm Rohs Compliant Multicomp Pro - 25AK3590 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Pad, 150Mm X 50Mm X 0.5Mm Rohs Compliant Multicomp Pro
25AK3590
Thermal Interface Pad, 150Mm X 50Mm X 0.5Mm Rohs Compliant Multicomp Pro 25AK3590
THERMAL INTERFACE PAD, 150Mm x 50Mm x 0.5MM ROHS COMPLIANT: YES

THERMAL INTERFACE PAD, 150Mm x 50Mm x 0.5MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 25AK3590
Product Name Thermal Interface Pad, 150Mm X 50Mm X 0.5Mm Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - NH Nonhardening - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Liquid; Gap Filler, Foam in Place Gasket
Use Temperature 32 to 410 F (0 to 210 C)
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Carbon Fiber Thermal Interface Material for LCD and Plasma TVs - CSF15 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Industry Electronics
Use Temperature ? to 320 F (? to 160 C)
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details