multicomp PRO Thermal Interface Pad, 200Mm X 200Mm X 3Mm Rohs Compliant Multicomp Pro MP008833

Description

THERMAL INTERFACE PAD, 200Mm x 200Mm x 3MM ROHS COMPLIANT: YES

Newark, An Avnet Company

Description

THERMAL INTERFACE PAD, 200Mm x 200Mm x 3MM ROHS COMPLIANT: YES

Suppliers

Company

Product

Description

Supplier Links

Newark, An Avnet Company

Chicago, IL, United States

Thermal Interface Pad, 200Mm X 200Mm X 3Mm Rohs Compliant Multicomp Pro
25AK3584

Thermal Interface Pad, 200Mm X 200Mm X 3Mm Rohs Compliant Multicomp Pro 25AK3584

THERMAL INTERFACE PAD, 200Mm x 200Mm x 3MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

	Newark, An Avnet Company
Product Category	Thermal Compounds and Thermal Interface Materials
Product Number	25AK3584
Product Name	Thermal Interface Pad, 200Mm X 200Mm X 3Mm Rohs Compliant Multicomp Pro

Unlock Full Specs

to access all available technical data

Similar Products

CHT USA Inc.

1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed

AS1707

Specs

Cure / Technology Single Component; Alkoxy

Chemical System Silicone

Industry Automotive; Electronics

View Details

Hernon Manufacturing, Inc.

Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D

746D

Specs

Cure / Technology Room Temperature Vulcanizing or Curing

Chemical System Silicone

Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial

View Details

ELANTAS North America LLC

Ripley™

E 468-2-7-55F

Specs

Type High Dielectric

Cure / Technology Thermoset; Single Component

Form / Shape Liquid

View Details

Master Bond, Inc.

Two Component Epoxy Resin System

Supreme 11AOHTLP

Specs

Type High Dielectric

Cure / Technology Thermoset; Two Component ; Room Temperature Vulcanizing or Curing

Form / Shape Grease, Paste

View Details