multicomp PRO Thermal Interface Pad, 150Mm X 150Mm X 3Mm Rohs Compliant Multicomp Pro MP008813

Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 3MM ROHS COMPLIANT: YES
Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 3MM ROHS COMPLIANT: YES

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Pad, 150Mm X 150Mm X 3Mm Rohs Compliant Multicomp Pro - 25AK3564 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Pad, 150Mm X 150Mm X 3Mm Rohs Compliant Multicomp Pro
25AK3564
Thermal Interface Pad, 150Mm X 150Mm X 3Mm Rohs Compliant Multicomp Pro 25AK3564
THERMAL INTERFACE PAD, 150Mm x 150Mm x 3MM ROHS COMPLIANT: YES

THERMAL INTERFACE PAD, 150Mm x 150Mm x 3MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 25AK3564
Product Name Thermal Interface Pad, 150Mm X 150Mm X 3Mm Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Toughened One Part Epoxy for Chip Coating Applications - Supreme 3HTND-2CCM - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Glob Top, Daub, Doming or Overfill; Die Bonding Adhesives; Grease, Paste; Gap Filler, Foam in Place Gasket
View Details
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D - 746D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Chemical System Silicone
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Heat Transfer Compound - T-99 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 2200 F (0 to 1204 C)
View Details