multicomp PRO Thermal Interface Pad, 150Mm X 150Mm X 1Mm Rohs Compliant Multicomp Pro MP008810

Description

THERMAL INTERFACE PAD, 150Mm x 150Mm x 1MM ROHS COMPLIANT: YES

Newark, An Avnet Company

Description

THERMAL INTERFACE PAD, 150Mm x 150Mm x 1MM ROHS COMPLIANT: YES

Suppliers

Company

Product

Description

Supplier Links

Newark, An Avnet Company

Chicago, IL, United States

Thermal Interface Pad, 150Mm X 150Mm X 1Mm Rohs Compliant Multicomp Pro
25AK3561

Thermal Interface Pad, 150Mm X 150Mm X 1Mm Rohs Compliant Multicomp Pro 25AK3561

THERMAL INTERFACE PAD, 150Mm x 150Mm x 1MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

	Newark, An Avnet Company
Product Category	Thermal Compounds and Thermal Interface Materials
Product Number	25AK3561
Product Name	Thermal Interface Pad, 150Mm X 150Mm X 1Mm Rohs Compliant Multicomp Pro

Unlock Full Specs

to access all available technical data

Similar Products

CHT USA Inc.

2-Part, Thermally Conductive Silicone Encapsulants, UL Listed

SE3000

Specs

Cure / Technology Two Component ; Addition

Industry Electronics

Features Flame Retardant; UL Rating

View Details

Dongguan Sheen Electronic Technology Co., Ltd.

Carbon Fiber Thermal Pad for Communication and Power Equipment

CSF35

Specs

Form / Shape Pad

Industry Electronics

Use Temperature ? to 320 F (? to 160 C)

View Details

Quantaflex Printed Electronics Inc.

Thermal Interface Materials

Specs

Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket

Industry Electronics; Semiconductors, IC's

Features EMI/RFI Shielding

View Details

Fujipoly® America Corp.

High Performance Gap Filler

SARCON ® GR80A

Specs

Form / Shape Gel; Gap Filler, Foam in Place Gasket

Chemical System Silicone

Gap Fill 0.0394 to 0.1181 inch (1 to 3 mm)

View Details