multicomp PRO Thermal Interface Pad, 150Mm X 150Mm X 2Mm Rohs Compliant Multicomp Pro MP008807

Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 2MM ROHS COMPLIANT: YES
Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 2MM ROHS COMPLIANT: YES

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Pad, 150Mm X 150Mm X 2Mm Rohs Compliant Multicomp Pro - 25AK3558 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Pad, 150Mm X 150Mm X 2Mm Rohs Compliant Multicomp Pro
25AK3558
Thermal Interface Pad, 150Mm X 150Mm X 2Mm Rohs Compliant Multicomp Pro 25AK3558
THERMAL INTERFACE PAD, 150Mm x 150Mm x 2MM ROHS COMPLIANT: YES

THERMAL INTERFACE PAD, 150Mm x 150Mm x 2MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 25AK3558
Product Name Thermal Interface Pad, 150Mm X 150Mm X 2Mm Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-3 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Grease, Paste; Gap Filler, Foam in Place Gasket
Use Temperature 32 to 850 F (0 to 454 C)
View Details
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity - MasterSil 170 Gel - Master Bond, Inc.
Specs
Type High Dielectric; Optical
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Form / Shape Liquid
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details