multicomp PRO Thermal Pad, 150Mm X 150Mm X 0.5Mm, Purp Rohs Compliant Multicomp Pro MP-TG-A4500-150-0.5

Description
THERMAL PAD, 150MM X 150MM X 0.5MM, PURP ROHS COMPLIANT: YES
Datasheet
Description
THERMAL PAD, 150MM X 150MM X 0.5MM, PURP ROHS COMPLIANT: YES
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Pad, 150Mm X 150Mm X 0.5Mm, Purp Rohs Compliant Multicomp Pro - 49AH9361 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Pad, 150Mm X 150Mm X 0.5Mm, Purp Rohs Compliant Multicomp Pro
49AH9361
Thermal Pad, 150Mm X 150Mm X 0.5Mm, Purp Rohs Compliant Multicomp Pro 49AH9361
THERMAL PAD, 150MM X 150MM X 0.5MM, PURP ROHS COMPLIANT: YES

THERMAL PAD, 150MM X 150MM X 0.5MM, PURP ROHS COMPLIANT: YES

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 49AH9361
Product Name Thermal Pad, 150Mm X 150Mm X 0.5Mm, Purp Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Pedigree® - 40 VTC-40F - ELANTAS North America LLC
ELANTAS North America LLC
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Underfill Materials for Printed Circuit Boards (PCBs) - ALPHA ® HiTech ® CU31-3300 - MacDermid Alpha Electronics Solutions
Specs
Industry Electronics; Semiconductors, IC's
Elongation 10.1 %
Dielectric Strength 635 kV/in (250 kV/cm)
View Details