Sarcon® SG-07SL and SG-26SL are highly thermally conductive, non-reactive silicone-based greases that offer low thermal resistance and maintain a nonflow able composition. Unique binding agents and product formulation ensure the lowest amount of bleed and evaporation. Suited for thin bond line applications. Sarcon® SG-07NS and SG-26NS are non-silicone, polysynthetic-based thermal greases that have high thermal conductivity properties. Infused with heat-conductive metal oxides, this nonmigrating material operates consistently in high temperatures. Sarcon® non silicone greases offer all the benefits of a silicone-based compound without the problem of contamination.
FEATURES:
Silicone and non-silicone formulations
Thermal conductivity up to 2.6 W/m°K
Low bleed and evaporation
No migration for non-silicone formulations over wide temperature range
Non-toxic
Thin bond lines 1 mil
Easy to apply and re-work
APPLICATIONS:
Standard dc/dc power converter and dc/ac inverter
High performance CPUs
Between any heat generating semiconductor and heat sink
Custom power modules
Telecommunications and automotive electronics
PACKAGING OPTIONS:
Pre-filled syringes: 3cc (6g), 10cc (28g), 30cc (72g)
Jar containers: 1 lb. (454g)
Custom packaging: Available on request
Sarcon® SG-07SL and SG-26SL are highly thermally conductive, non-reactive silicone-based greases that offer low thermal resistance and maintain a nonflow able composition. Unique binding agents and product formulation ensure the lowest amount of bleed and evaporation. Suited for thin bond line applications.
Sarcon® SG-07NS and SG-26NS are non-silicone, polysynthetic-based thermal greases that have high thermal conductivity properties. Infused with heat-conductive metal oxides, this nonmigrating material operates consistently in high temperatures. Sarcon® non silicone greases offer all the benefits of a silicone-based compound without the problem of contamination.
FEATURES:
- Silicone and non-silicone formulations
- Thermal conductivity up to 2.6 W/m°K
- Low bleed and evaporation
- No migration for non-silicone formulations over wide temperature range
- Non-toxic
- Thin bond lines 1 mil
- Easy to apply and re-work
APPLICATIONS:
- Standard dc/dc power converter and dc/ac inverter
- High performance CPUs
- Between any heat generating semiconductor and heat sink
- Custom power modules
- Telecommunications and automotive electronics
PACKAGING OPTIONS:
- Pre-filled syringes: 3cc (6g), 10cc (28g), 30cc (72g)
- Jar containers: 1 lb. (454g)
- Custom packaging: Available on request
