Momentive Performance Materials Inc. Momentive TSE3941 White Potting & Encapsulating Compound - Weight:.15 kg 25008

Description
Momentive white TSE3941 potting & encapsulating compound is compatible with metal materials with a 72 hr cure time.
  • Momentive TSE3941 White Potting & Encapsulating Compound - Weight:.15 kg - TSE3941 150GR - R. S. Hughes Company, Inc.
    R. S. Hughes Company, Inc.
Description
Momentive white TSE3941 potting & encapsulating compound is compatible with metal materials with a 72 hr cure time.

Suppliers

Company
Product
Description
Supplier Links
Momentive TSE3941 White Potting & Encapsulating Compound - Weight:.15 kg - TSE3941 150GR - R. S. Hughes Company, Inc.
R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Momentive TSE3941 White Potting & Encapsulating Compound - Weight:.15 kg
TSE3941 150GR
Momentive TSE3941 White Potting & Encapsulating Compound - Weight:.15 kg TSE3941 150GR
Momentive white TSE3941 potting & encapsulating compound is compatible with metal materials with a 72 hr cure time.

Momentive white TSE3941 potting & encapsulating compound is compatible with metal materials with a 72 hr cure time.

Buy Now

Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Encapsulants and Potting Compounds
Product Number TSE3941 150GR
Product Name Momentive TSE3941 White Potting & Encapsulating Compound - Weight:.15 kg
Thermal Conductivity 0.8300 W/m-K (0.4796 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Formulations - Applications - Bonding - Tuffbond 305 - 3305AB22 - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Bonding - Tuffbond 305
3305AB22
Specs
Form / Function 50 ml (two component)
Chemical System Ceramic; Epoxy
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Solvent Resistant Adhesive Withstands Methylene Cholride - EP41S-5 - Master Bond, Inc.
Master Bond, Inc.
Solvent Resistant Adhesive Withstands Methylene Cholride
EP41S-5
Specs
Type High Dielectric; Thermal Insulation
Form / Function Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
Cure / Technology Thermoset; Two Component  ; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
View Details
Carbon Fiber Encapsulation - Wraptite® - Arnold Magnetic Technologies
Arnold Magnetic Technologies
Carbon Fiber Encapsulation
Wraptite®
Specs
Cure / Technology Wound in place or pressed on sleeve
Chemical System Include Carbon Fiber, Zylon Fiber And Glass Fiber Composites
Industry Aerospace; Automotive; OEM or Industrial; Oil and Gas
View Details
Potting Resin - 982384-000 - TE Connectivity
TE Connectivity
Potting Resin
982384-000
Specs
Chemical System Polyurethane; Two-Part Polyurethane
View Details