Momentive Performance Materials Inc. Momentive TSE399 Clear Potting & Encapsulating Compound - 18 kg Pail 21897

Description
Momentive clear TSE399 potting & encapsulating compound is compatible with metal materials with a 72 hr cure time.
  • Momentive TSE399 Clear Potting & Encapsulating Compound - 18 kg Pail - TSE399-C 18K - R. S. Hughes Company, Inc.
    R. S. Hughes Company, Inc.
Description
Momentive clear TSE399 potting & encapsulating compound is compatible with metal materials with a 72 hr cure time.

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Momentive TSE399 Clear Potting & Encapsulating Compound - 18 kg Pail - TSE399-C 18K - R. S. Hughes Company, Inc.
R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Momentive TSE399 Clear Potting & Encapsulating Compound - 18 kg Pail
TSE399-C 18K
Momentive TSE399 Clear Potting & Encapsulating Compound - 18 kg Pail TSE399-C 18K
Momentive clear TSE399 potting & encapsulating compound is compatible with metal materials with a 72 hr cure time.

Momentive clear TSE399 potting & encapsulating compound is compatible with metal materials with a 72 hr cure time.

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Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Encapsulants and Potting Compounds
Product Number TSE399-C 18K
Product Name Momentive TSE399 Clear Potting & Encapsulating Compound - 18 kg Pail
Dielectric Strength 560 kV/in (220 kV/cm)
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