Momentive Performance Materials Inc. Momentive TSE399 Clear Potting & Encapsulating Compound - 18 kg Pail 21897

Description

Momentive clear TSE399 potting & encapsulating compound is compatible with metal materials with a 72 hr cure time.

R. S. Hughes Company, Inc.

Description

Momentive clear TSE399 potting & encapsulating compound is compatible with metal materials with a 72 hr cure time.

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R. S. Hughes Company, Inc.

Sunnyvale, CA, USA

Momentive TSE399 Clear Potting & Encapsulating Compound - 18 kg Pail
TSE399-C 18K

Momentive TSE399 Clear Potting & Encapsulating Compound - 18 kg Pail TSE399-C 18K

Momentive clear TSE399 potting & encapsulating compound is compatible with metal materials with a 72 hr cure time.

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Technical Specifications

	R. S. Hughes Company, Inc.
Product Category	Encapsulants and Potting Compounds
Product Number	TSE399-C 18K
Product Name	Momentive TSE399 Clear Potting & Encapsulating Compound - 18 kg Pail
Dielectric Strength	560 kV/in (220 kV/cm)

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