Momentive Performance Materials Inc. Momentive TSE3251 White Potting & Encapsulating Compound - 18 kg Pail 20553

Description
Momentive white TSE3251 potting & encapsulating compound with a 4 hr @ 212F cure time.
Description
Momentive white TSE3251 potting & encapsulating compound with a 4 hr @ 212F cure time.

Suppliers

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Description
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Momentive TSE3251 White Potting & Encapsulating Compound - 18 kg Pail - TSE3251 18K - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Momentive TSE3251 White Potting & Encapsulating Compound - 18 kg Pail
TSE3251 18K
Momentive TSE3251 White Potting & Encapsulating Compound - 18 kg Pail TSE3251 18K
Momentive white TSE3251 potting & encapsulating compound with a 4 hr @ 212F cure time.

Momentive white TSE3251 potting & encapsulating compound with a 4 hr @ 212F cure time.

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Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Encapsulants and Potting Compounds
Product Number TSE3251 18K
Product Name Momentive TSE3251 White Potting & Encapsulating Compound - 18 kg Pail
Thermal Conductivity 0.1800 W/m-K (0.1040 BTU-ft/hr-ft²-F)
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