Gelest, Inc. EPOXYPROPOXYPROPYL TERMINATED POLYDIMETHYLSILOXANE, 100-140 cSt DMS-E21

Description
Safety Packaging Under Nitrogen
  • EPOXYPROPOXYPROPYL TERMINATED POLYDIMETHYLSILOXANE, 100-140 cSt - DMS-E21 - Gelest, Inc.
    Gelest, Inc.
Datasheet
Description
Safety Packaging Under Nitrogen
Datasheet

Suppliers

Company
Product
Description
Supplier Links
EPOXYPROPOXYPROPYL TERMINATED POLYDIMETHYLSILOXANE, 100-140 cSt - DMS-E21 - Gelest, Inc.
Gelest, Inc.
Morrisville, PA, United States
EPOXYPROPOXYPROPYL TERMINATED POLYDIMETHYLSILOXANE, 100-140 cSt
DMS-E21
EPOXYPROPOXYPROPYL TERMINATED POLYDIMETHYLSILOXANE, 100-140 cSt DMS-E21
Safety Packaging Under Nitrogen

Safety


  • Packaging Under Nitrogen
Supplier's Site Datasheet

Technical Specifications

  Gelest, Inc.
Product Category Industrial Adhesives
Product Number DMS-E21
Product Name EPOXYPROPOXYPROPYL TERMINATED POLYDIMETHYLSILOXANE, 100-140 cSt
Chemical System Silicone
Unlock Full Specs
to access all available technical data

Similar Products

UV-Curing Epoxy, NOA 85, 6 gm Syringe - NOA-85S - Newport MKS
Newport MKS
UV-Curing Epoxy, NOA 85, 6 gm Syringe
NOA-85S
Specs
Cure / Technology UV or Radiation Cured
Chemical System Epoxy
View Details
Glue, Adhesives, Applicators - S1264-KIT-1-ND - DigiKey
TE Connectivity
Glue, Adhesives, Applicators
S1264-KIT-1
Specs
Chemical System Epoxy
View Details
Heat Transfer Compound - T-99 - Thermon, Inc
Thermon, Inc
Heat Transfer Compound
T-99
Specs
Cure / Technology Single Component
Features Thermally Conductive
Use Temperature 32 to 2200 F (0 to 1204 C)
View Details
Low oil-bleed processor cooling gel - SE35 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Low oil-bleed processor cooling gel
SE35
Specs
Chemical System Silicone
Type / Form Gel
Features Thermally Conductive
View Details