Dymax Dymax Multi-Cure 921-Gel UV Curing Adhesive Clear 30 mL MR Syringe 921-GEL 30ML MR SYRINGE

Description
DYMAX Multi-Cure 921-Gel Clear is a UV light and heat curing urethane resin that is used for potting and bonding metal, plastics, ceramics, and glass. It offers high tensile strength and consists of 100% solids. 30 mL MR Syringe.
Request a Quote Datasheet
Description
DYMAX Multi-Cure 921-Gel Clear is a UV light and heat curing urethane resin that is used for potting and bonding metal, plastics, ceramics, and glass. It offers high tensile strength and consists of 100% solids. 30 mL MR Syringe.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Dymax Multi-Cure 921-Gel UV Curing Adhesive Clear 30 mL MR Syringe - 921-GEL 30ML MR SYRINGE - Ellsworth Adhesives
Germantown, WI, USA
Dymax Multi-Cure 921-Gel UV Curing Adhesive Clear 30 mL MR Syringe
921-GEL 30ML MR SYRINGE
Dymax Multi-Cure 921-Gel UV Curing Adhesive Clear 30 mL MR Syringe 921-GEL 30ML MR SYRINGE
DYMAX Multi-Cure 921-Gel Clear is a UV light and heat curing urethane resin that is used for potting and bonding metal, plastics, ceramics, and glass. It offers high tensile strength and consists of 100% solids. 30 mL MR Syringe.

DYMAX Multi-Cure 921-Gel Clear is a UV light and heat curing urethane resin that is used for potting and bonding metal, plastics, ceramics, and glass. It offers high tensile strength and consists of 100% solids. 30 mL MR Syringe.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Adhesives
Product Number 921-GEL 30ML MR SYRINGE
Product Name Dymax Multi-Cure 921-Gel UV Curing Adhesive Clear 30 mL MR Syringe
Cure / Technology Single Component
Substrate Compatibility Ceramic, Glass; Metal; Plastic
Viscosity 25000 cP
Unlock Full Specs
to access all available technical data

Similar Products

Electrically Isolating Epoxy Features Ultra High Heat Transfer Capability - EP5TC-80 - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Single Component
Chemical System Epoxy
Composition Filled
View Details
Formulations - Applications - Bonding - Ultrabond 774 - 377430 - Hernon Manufacturing, Inc.
Specs
Cure / Technology UV or Radiation Cured
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Low Thermal Resistance Carbon Fiber Thermal Gap Pad for Semiconductor Heat Sinks - CSF45 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Features Thermally Conductive
Industry Electronics
Use Temperature ? to 320 F (? to 160 C)
View Details