Minerallac Company Caulk 96055

Description
FIRE-RATED GYPSUM WALLBOARD PARTITIONS, CONCRETE WALLS/FLOORS, WOOD FLOORS/CONCRETE OR CORRUGATED STEEL DECK FLOOR/CEILING ASSEMBLY APPLICATION TUBE CONTAINER TYPE 10.5 OZ CONTAINER CAPACITY SPECIFIC GRAVITY 1.25 BASE CONTENT WATER BOILING POINT 212 DEG F PACKAGING QUANTITY 24 PER CASE
  • Caulk - 96055 - Minerallac Company
    Minerallac Company
Datasheet
Description
FIRE-RATED GYPSUM WALLBOARD PARTITIONS, CONCRETE WALLS/FLOORS, WOOD FLOORS/CONCRETE OR CORRUGATED STEEL DECK FLOOR/CEILING ASSEMBLY APPLICATION TUBE CONTAINER TYPE 10.5 OZ CONTAINER CAPACITY SPECIFIC GRAVITY 1.25 BASE CONTENT WATER BOILING POINT 212 DEG F PACKAGING QUANTITY 24 PER CASE
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Caulk - 96055 - Minerallac Company
Minerallac Company
Hampshire, IL, USA
Caulk
96055
Caulk 96055
FIRE-RATED GYPSUM WALLBOARD PARTITIONS, CONCRETE WALLS/FLOORS, WOOD FLOORS/CONCRETE OR CORRUGATED STEEL DECK FLOOR/CEILING ASSEMBLY APPLICATION TUBE CONTAINER TYPE 10.5 OZ CONTAINER CAPACITY SPECIFIC GRAVITY 1.25 BASE CONTENT WATER BOILING POINT 212 DEG F PACKAGING QUANTITY 24 PER CASE
  • FIRE-RATED GYPSUM WALLBOARD PARTITIONS, CONCRETE WALLS/FLOORS, WOOD FLOORS/CONCRETE OR CORRUGATED STEEL DECK FLOOR/CEILING ASSEMBLY APPLICATION
  • TUBE CONTAINER TYPE
  • 10.5 OZ CONTAINER CAPACITY
  • SPECIFIC GRAVITY 1.25
  • BASE CONTENT WATER
  • BOILING POINT 212 DEG F
  • PACKAGING QUANTITY 24 PER CASE
Datasheet

Technical Specifications

  Minerallac Company
Product Category Industrial Sealants
Product Number 96055
Product Name Caulk
Features Caulk, Grout
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Type / Form Liquid; Sheet or Film
Features EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Thermally Conductive
Industry Electronics; Semiconductors, IC's
View Details
Liquid Gap Fillers for Electronics - Electrolube ® LGF200 Liquid Gap Filler - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Liquid Gap Fillers for Electronics
Electrolube ® LGF200 Liquid Gap Filler
Specs
Cure / Technology Two Component  
Type / Form Liquid
Features Electrically Conductive; Leveling Filling; Gap Filler, Foam in Place Gasket; Thermally Conductive
View Details
Epoxylite® - E 5526 Hi Temp Epoxy Kit - ELANTAS North America LLC
ELANTAS North America LLC
Epoxylite®
E 5526 Hi Temp Epoxy Kit
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Dissimilar Substrates
View Details
1-Part, General Purpose, RTV Silicone Adhesive Sealant - AS5702 - CHT USA Inc.
CHT USA Inc.
1-Part, General Purpose, RTV Silicone Adhesive Sealant
AS5702
Specs
Cure / Technology Single Component; Alkoxy
Chemical System Silicone
Industry Automotive; Electronics
View Details