Micron Technology, Inc. Memory NAND32GW3F2DDI6P

Description
Memory IC
  • Memory - NAND32GW3F2DDI6P - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
  • Memory - NAND32GW3F2DDI6P - Lingto Electronic Limited
    Lingto Electronic Limited
Datasheet
Description
Memory IC
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - NAND32GW3F2DDI6P - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Memory
NAND32GW3F2DDI6P
Memory NAND32GW3F2DDI6P
Memory IC

Memory IC

Buy Now
Memory - NAND32GW3F2DDI6P - Lingto Electronic Limited
Lingto Electronic Limited
Shenzhen, China
Memory
NAND32GW3F2DDI6P
Memory NAND32GW3F2DDI6P
SLC NAND

SLC NAND

Supplier's Site Datasheet

Technical Specifications

  Quarktwin Technology Ltd. Lingto Electronic Limited
Product Category Memory Chips Memory Chips
Product Number NAND32GW3F2DDI6P NAND32GW3F2DDI6P
Product Name Memory Memory
Unlock Full Specs
to access all available technical data

Similar Products

Memory - SMJ44400 - Micross Components, Inc.
Micross Components, Inc.
Memory
SMJ44400
Specs
Memory Category DRAM; DRAM Chip
Access Time 80 to 120 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details
Controllers - BQ2205LYPWRG4 - ODG (Origin Data Global)
Texas Instruments
Controllers
BQ2205LYPWRG4
Specs
Memory Category SRAM Chip
Operating Temperature -20 to 70 C (-4 to 158 F)
Package Type 16-TSSOP (0.173", 4.40mm Width)
View Details
4 suppliers
Memory - 71124S12Y - Lingto Electronic Limited
Rochester Electronics
Memory
71124S12Y
Specs
Memory Category SRAM; SRAM Chip
Access Time 12 ns
Density 1000 kbits
View Details
Infineon Technologies AG
Integrated Circuits (ICs) - Memory - Memory
28443776C
View Details