Manufacturer: Micron Technology Inc.
Win Source Part Number: 847117-MT53E512M32D2
Features: Memory IC 2.133 GHz
Package: Box
Part Status: Obsolete
Family Name: MT53E512
Categories: Integrated Circuits (ICs)
ECCN: OBSOLETE
Popularity: Medium
Fake Threat In the Open Market: 80 pct.
Supply and Demand Status: Limited
Quantity per package: 1360
MSL Level: 1 (Unlimited)
IC DRAM 16GBIT 2.133GHZ 200WFBGA Product overview: MT53E512M32D2NP-046 from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 2.133GHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 2.133GHZ, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53E512M32D2NP-
SDRAM - Mobile LPDDR4 Memory IC 16Gb (512M x 32) 2.133GHz
SDRAM - Mobile LPDDR4 Memory IC 16Gbit 2.133 GHz 200-WFBGA (10x14.5)
IC DRAM 16GBIT 2.133GHZ 200WFBGA
LPDDR4 16G 512MX32 FBGA WT DDP
| Win Source Electronics | ERSAELECTRONICS PTE. LTD. | DigiKey | Quarktwin Technology Ltd. | Shenzhen Shengyu Electronics Technology Limited | Lingto Electronic Limited | |
|---|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 847117-MT53E512M32D2NP-046 | 774-MT53E512M32D2NP-046 | MT53E512M32D2NP-046-ND | MT53E512M32D2NP-046 | MT53E512M32D2NP-046 | MT53E512M32D2NP-046 |
| Product Name | Memory - DDR - MT53E512M32D2NP-046 | 2.133GHZ Memory IC and Storage Component | Memory | Memory | Integrated Circuits (ICs) - Memory - Memory | Memory |
| Memory Category | Volatile; DRAM Chip | DRAM Chip | DRAM; DRAM Chip | Volatile; DRAM Chip | DRAM; DRAM Chip | |
| Operating Temperature | 0 to 95 C (32 to 203 F) | 0 to 95 C (32 to 203 F) | 0 to 95 C (32 to 203 F) | |||
| Package Type | BGA; Box | 200-WFBGA | BGA; 200-WFBGA |
