Manufacturer: Micron Technology Inc.
Operating Temperature Range: -30°C ~ 85°C (TC)
Features: SDRAM - Mobile LPDDR4 Memory IC 16Gb (512M x 32) - 2.133 GHz
Package: Tray
Family Name: MT53E512
Categories: Integrated Circuits (ICs)
Popularity: Medium
Fake Threat In the Open Market: 74 pct.
Supply and Demand Status: Limited
Quantity per package: 136
Estimated Pruduction Lead Time: 35 Weeks
IC DRAM 16GBIT 2.133GHZ 200WFBGA Product overview: MT53E512M32D2NP-046 WT:F from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 2.133GHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 2.133GHZ, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53E512M32D2NP-
SDRAM - Mobile LPDDR4 Memory IC 16Gb (512M x 32) 2.133GHz
LPDDR416G512MX32FBGA
LPDDR4 16G 512MX32 FBGA DDP
SDRAM - Mobile LPDDR4 Memory IC 16Gbit 2.133 GHz 200-WFBGA (10x14.5)
LPDDR4 16G 512MX32 FBGA DDP
LPDDR4 16G 512MX32 FBGA DDP
| Win Source Electronics | ERSAELECTRONICS PTE. LTD. | DigiKey | Newark, An Avnet Company | Shenzhen Shengyu Electronics Technology Limited | Quarktwin Technology Ltd. | Lingto Electronic Limited | ODG (Origin Data Global) | |
|---|---|---|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 774-MT53E512M32D2NP-046 WT:F | 557-MT53E512M32D2NP-046WT:F-ND | 80AH8426 | MT53E512M32D2NP-046 WT:F | MT53E512M32D2NP-046 WT:F | MT53E512M32D2NP-046 WT:F | MT53E512M32D2NP-046 WT:F | |
| Product Name | Memory - DDR - MT53E512M32D2NP-046 WT:F | 2.133GHZ Memory IC and Storage Component | Memory | Lpddr416G512Mx32Fbgaddp, Tray Rohs Compliant Micron | Integrated Circuits (ICs) - Memory | Memory | Memory | Memory |
| Operating Temperature | -30 to 85 C (-22 to 185 F) | -30 to 85 C (-22 to 185 F) | -30 to 85 C (-22 to 185 F) | -30 to 85 C (-22 to 185 F) | -30 to 85 C (-22 to 185 F) | -30 to 85 C (-22 to 185 F) | ||
| Memory Category | Volatile; DRAM Chip | DRAM Chip | Volatile; DRAM Chip | DRAM; DRAM Chip | DRAM; DRAM Chip | SDRAM - Mobile LPDDR4 | ||
| Package Type | BGA; Tray | 200-WFBGA | BGA | BGA; 200-WFBGA | 200-WFBGA |
