IC DRAM 8GBIT 2.133GHZ 200WFBGA Product overview: MT53E256M32D2DS-046 WT:B from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 2.133GHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 2.133GHZ, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53E256M32D2DS-
SDRAM - Mobile LPDDR4 Memory IC 8Gb (256M x 32) 2.133GHz 200-WFBGA (10x14.5)
Series: *
Categories: Memory
LPDDR4 8G 256MX32 FBGA DDP
LPDDR4 8G 256MX32 FBGA DDP
SDRAM - Mobile LPDDR4 Memory IC 8Gbit 2.133 GHz 200-WFBGA (10x14.5)
DRAM, 256M X 32BIT, -30 TO 85DEG C; DRAM Type:LPDDR4; DRAM Density:8Gbit; DRAM Memory Configuration:256M x 32bit; Clock Frequency:2.133GHz; Memory Case Style:WFBGA; No. of Pins:200Pins; Supply Voltage Nom:1.1V; Access Time:- RoHS Compliant: Yes
| ERSAELECTRONICS PTE. LTD. | DigiKey | Win Source Electronics | Lingto Electronic Limited | Shenzhen Shengyu Electronics Technology Limited | Quarktwin Technology Ltd. | Newark, An Avnet Company | |
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| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 774-MT53E256M32D2DS-046 WT:B | 557-MT53E256M32D2DS-046WT:B-ND | MT53E256M32D2DS-046 WT:B | MT53E256M32D2DS-046 WT:B | MT53E256M32D2DS-046 WT:B | 80AH8364 | |
| Product Name | 2.133GHZ Memory IC and Storage Component | Memory | Memory - DDR - MT53E256M32D2DS-046 WT:B | Memory | Integrated Circuits (ICs) - Memory | Memory | Dram, 256M X 32Bit, -30 To 85Deg C; Dram Type Micron |
| Memory Category | Volatile; DRAM Chip | DRAM Chip | DRAM; DRAM Chip | Volatile; DRAM Chip | DRAM; DRAM Chip | DRAM Chip | |
| Operating Temperature | -30 to 85 C (-22 to 185 F) | -30 to 85 C (-22 to 185 F) | -30 to 85 C (-22 to 185 F) | -30 to 85 C (-22 to 185 F) | |||
| Package Type | BGA; Tray | 200-WFBGA | BGA | BGA; 200-WFBGA | WFBGA | ||
| Supply Voltage | 1.1V | 1.1V | 1.1V |
