Micron Technology, Inc. Memory MT53E1G32D2FW-046 AAT:B TR

Description
IC DRAM 32GBIT PAR 200TFBGA
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Description
IC DRAM 32GBIT PAR 200TFBGA
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - 557-MT53E1G32D2FW-046AAT:BTR-ND - DigiKey
Thief River Falls, MN, United States
IC DRAM 32GBIT PAR 200TFBGA

IC DRAM 32GBIT PAR 200TFBGA

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Memory IC and Storage Component - 774-MT53E1G32D2FW-046 AAT:B TR - ERSAELECTRONICS PTE. LTD.
Singapore
Memory IC and Storage Component
774-MT53E1G32D2FW-046 AAT:B TR
Memory IC and Storage Component 774-MT53E1G32D2FW-046 AAT:B TR
LPDDR4 32G 1GX32 FBGA DDP Product overview: MT53E1G32D2FW-046 AAT:B TR from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53E1G32D2FW-04 6 AAT:B TR can be used for catalog matching and distributor lookup.

LPDDR4 32G 1GX32 FBGA DDP Product overview: MT53E1G32D2FW-046 AAT:B TR from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53E1G32D2FW-046 AAT:B TR can be used for catalog matching and distributor lookup.

Supplier's Site
Integrated Circuits (ICs) - Memory - Memory -  - Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Memory - Memory
Integrated Circuits (ICs) - Memory - Memory
Category: Integrated Circuits (ICs) - Memory - Memory Package: Tape & Reel Temperature Range - Operating: -40°C ~ 105°C (TC) Fake Threat In the Open Market: 44 pct. Mfr: Micron Technology Inc. Series: Automotive, AEC-Q100 Product Status: Active Package / Case: 200-TFBGA Supplier Device Package: 200-TFBGA (10x14.5) Technology: SDRAM - Mobile LPDDR4X Mounting Type: Surface Mount Voltage - Supply: 1.06V ~ 1.17V Memory Type: Volatile Memory Format: DRAM Memory Size: 32Gbit Memory Organization: 1G x 32 Memory Interface: Parallel Clock Frequency: 2.133 GHz Write Cycle Time - Word, Page: 18ns Access Time: 3.5 ns

Category: Integrated Circuits (ICs) - Memory - Memory
Package: Tape & Reel
Temperature Range - Operating: -40°C ~ 105°C (TC)
Fake Threat In the Open Market: 44 pct.
Mfr: Micron Technology Inc.
Series: Automotive, AEC-Q100
Product Status: Active
Package / Case: 200-TFBGA
Supplier Device Package: 200-TFBGA (10x14.5)
Technology: SDRAM - Mobile LPDDR4X
Mounting Type: Surface Mount
Voltage - Supply: 1.06V ~ 1.17V
Memory Type: Volatile
Memory Format: DRAM
Memory Size: 32Gbit
Memory Organization: 1G x 32
Memory Interface: Parallel
Clock Frequency: 2.133 GHz
Write Cycle Time - Word, Page: 18ns
Access Time: 3.5 ns

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Technical Specifications

  DigiKey ERSAELECTRONICS PTE. LTD. Win Source Electronics
Product Category Memory Chips Memory Chips Memory Chips
Product Number 557-MT53E1G32D2FW-046AAT:BTR-ND 774-MT53E1G32D2FW-046 AAT:B TR
Product Name Memory Memory IC and Storage Component Integrated Circuits (ICs) - Memory - Memory
Memory Category DRAM Chip Volatile; DRAM Chip Volatile; DRAM Chip
Operating Temperature -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F)
Package Type 200-TFBGA BGA; Tape & Reel (TR)
Supply Voltage 1.06V ~ 1.17V 1.06V ~ 1.17V 1.06V ~ 1.17V
Access Time 3.5 ns 3.5 ns
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