Micron Technology, Inc. Memory MT53D384M32D2DS-046 WT ES:E

Description
IC DRAM 12GBIT 2133MHZ 200WFBGA
Description
IC DRAM 12GBIT 2133MHZ 200WFBGA

Suppliers

Company
Product
Description
Supplier Links
IC DRAM 12GBIT 2133MHZ 200WFBGA

IC DRAM 12GBIT 2133MHZ 200WFBGA

Supplier's Site
SDRAM - Mobile LPDDR4 Memory IC 12Gbit 2.133 GHz 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4 Memory IC 12Gbit 2.133 GHz 200-WFBGA (10x14.5)

Buy Now
Integrated Circuits (ICs) - Memory - Memory - MT53D384M32D2DS-046 WT ES:E - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory - Memory
MT53D384M32D2DS-046 WT ES:E
Integrated Circuits (ICs) - Memory - Memory MT53D384M32D2DS-046 WT ES:E
IC DRAM 12GBIT 2.133GHZ 200WFBGA

IC DRAM 12GBIT 2.133GHZ 200WFBGA

Supplier's Site

Technical Specifications

  Lingto Electronic Limited Quarktwin Technology Ltd. Shenzhen Shengyu Electronics Technology Limited
Product Category Memory Chips Memory Chips Memory Chips
Product Number MT53D384M32D2DS-046 WT ES:E MT53D384M32D2DS-046 WT ES:E MT53D384M32D2DS-046 WT ES:E
Product Name Memory Memory Integrated Circuits (ICs) - Memory - Memory
Memory Category DRAM; DRAM Chip DRAM; DRAM Chip Volatile; DRAM Chip
Density 12000000 kbits 12000000 kbits 12000000 kbits
Operating Temperature -30 to 85 C (-22 to 185 F)
Unlock Full Specs
to access all available technical data

Similar Products

SDRAM - 1882632P - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category DRAM Chip
Access Time 5 ns
Density 2048000 kbits
View Details
Memory - 28450379 A - Lingto Electronic Limited
Infineon Technologies AG
View Details
2 suppliers
Memory - MT5C1008 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category SRAM; SRAM Chip
Access Time 12 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details
 - 93425DMQB40 - Rochester Electronics
Specs
Memory Category SRAM Chip
Logic Family TTL
Package Type DIP; CDIP16
View Details
3 suppliers