Micron Technology, Inc. Integrated Circuits (ICs) - Memory - Memory MT53B512M64D4NW-062 WT ES:D

Description
IC DRAM 32GBIT 1.6GHZ FBGA
Description
IC DRAM 32GBIT 1.6GHZ FBGA

Suppliers

Company
Product
Description
Supplier Links
Futian, China
Integrated Circuits (ICs) - Memory - Memory
MT53B512M64D4NW-062 WT ES:D
Integrated Circuits (ICs) - Memory - Memory MT53B512M64D4NW-062 WT ES:D
IC DRAM 32GBIT 1.6GHZ FBGA

IC DRAM 32GBIT 1.6GHZ FBGA

Supplier's Site
SDRAM - Mobile LPDDR4 Memory IC 32Gbit 1.6 GHz

SDRAM - Mobile LPDDR4 Memory IC 32Gbit 1.6 GHz

Buy Now
IC DRAM 32GBIT 1600MHZ FBGA

IC DRAM 32GBIT 1600MHZ FBGA

Supplier's Site

Technical Specifications

  Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd. Lingto Electronic Limited
Product Category Memory Chips Memory Chips Memory Chips
Product Number MT53B512M64D4NW-062 WT ES:D MT53B512M64D4NW-062 WT ES:D MT53B512M64D4NW-062 WT ES:D
Product Name Integrated Circuits (ICs) - Memory - Memory Memory Memory
Memory Category Volatile; DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip
Unlock Full Specs
to access all available technical data

Similar Products

FIFOs Memory - SN74ACT7200L20NP - Quarktwin Technology Ltd.
Specs
Operating Temperature 0 to 70 C (32 to 158 F)
Density 2 kbits
Package Type DIP; 28-DIP (0.300\", 7.62mm)
View Details
Memory - 540746-002-00 - Lingto Electronic Limited
Infineon Technologies AG
View Details
2 suppliers
Memory - MT5C1009 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category SRAM; SRAM Chip
Access Time 12 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details
Memory - 6116SA15SOG - Lingto Electronic Limited
Rochester Electronics
Specs
Memory Category SRAM; SRAM Chip
Access Time 15 ns
Density 16 kbits
View Details