Micron Technology, Inc. Memory - SDRAM - MT53B256M32D1NP-062 AAT:C MT53B256M32D1NP-062 AAT:C

Description
Manufacturer: Micron Technology Inc. Series: Automotive, AEC-Q100 Operating Temperature Range: -40°C ~ 105°C (TC) Features: SDRAM - Mobile LPDDR4 Memory IC 8Gb (256M x 32) - 1.6 GHz 200-WFBGA (10x14.5) Package: Tray Package: 200-WFBGA Mounting: Surface Mount Part Status: Obsolete Family Name: MT53B256 Categories: Integrated Circuits (ICs) Case / Package: 200-WFBGA (10x14.5) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 48 pct. Supply and Demand Status: Balance Quantity per package: 1360 REACH Status: REACH Unaffected HTSUS: 8542.32.0036
Request a Quote Datasheet
Description
Manufacturer: Micron Technology Inc. Series: Automotive, AEC-Q100 Operating Temperature Range: -40°C ~ 105°C (TC) Features: SDRAM - Mobile LPDDR4 Memory IC 8Gb (256M x 32) - 1.6 GHz 200-WFBGA (10x14.5) Package: Tray Package: 200-WFBGA Mounting: Surface Mount Part Status: Obsolete Family Name: MT53B256 Categories: Integrated Circuits (ICs) Case / Package: 200-WFBGA (10x14.5) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 48 pct. Supply and Demand Status: Balance Quantity per package: 1360 REACH Status: REACH Unaffected HTSUS: 8542.32.0036
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - SDRAM - MT53B256M32D1NP-062 AAT:C -  - Win Source Electronics
Laguna Hills, CA, United States
Memory - SDRAM - MT53B256M32D1NP-062 AAT:C
Memory - SDRAM - MT53B256M32D1NP-062 AAT:C
Manufacturer: Micron Technology Inc. Series: Automotive, AEC-Q100 Operating Temperature Range: -40°C ~ 105°C (TC) Features: SDRAM - Mobile LPDDR4 Memory IC 8Gb (256M x 32) - 1.6 GHz 200-WFBGA (10x14.5) Package: Tray Package: 200-WFBGA Mounting: Surface Mount Part Status: Obsolete Family Name: MT53B256 Categories: Integrated Circuits (ICs) Case / Package: 200-WFBGA (10x14.5) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 48 pct. Supply and Demand Status: Balance Quantity per package: 1360 REACH Status: REACH Unaffected HTSUS: 8542.32.0036

Manufacturer: Micron Technology Inc.
Series: Automotive, AEC-Q100
Operating Temperature Range: -40°C ~ 105°C (TC)
Features: SDRAM - Mobile LPDDR4 Memory IC 8Gb (256M x 32) - 1.6 GHz 200-WFBGA (10x14.5)
Package: Tray
Package: 200-WFBGA
Mounting: Surface Mount
Part Status: Obsolete
Family Name: MT53B256
Categories: Integrated Circuits (ICs)
Case / Package: 200-WFBGA (10x14.5)
ECCN: EAR99
Popularity: High
Fake Threat In the Open Market: 48 pct.
Supply and Demand Status: Balance
Quantity per package: 1360
REACH Status: REACH Unaffected
HTSUS: 8542.32.0036

Buy Now
1.6GHZ Memory IC and Storage Component - 774-MT53B256M32D1NP-062 AAT:C - ERSAELECTRONICS PTE. LTD.
Singapore
1.6GHZ Memory IC and Storage Component
774-MT53B256M32D1NP-062 AAT:C
1.6GHZ Memory IC and Storage Component 774-MT53B256M32D1NP-062 AAT:C
IC DRAM 8GBIT 1.6GHZ 200WFBGA Product overview: MT53B256M32D1NP-062 AAT:C from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 1.6GHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 1.6GHZ, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53B256M32D1NP- 062 AAT:C can be used for catalog matching and distributor lookup.

IC DRAM 8GBIT 1.6GHZ 200WFBGA Product overview: MT53B256M32D1NP-062 AAT:C from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 1.6GHZ. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 1.6GHZ, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT53B256M32D1NP-062 AAT:C can be used for catalog matching and distributor lookup.

Supplier's Site
Lpddr48G256Mx32Fbga, Tray Rohs Compliant Micron - 80AH8203 - Newark, An Avnet Company
Chicago, IL, United States
Lpddr48G256Mx32Fbga, Tray Rohs Compliant Micron
80AH8203
Lpddr48G256Mx32Fbga, Tray Rohs Compliant Micron 80AH8203
LPDDR48G256MX32FBGA, TRAY ROHS COMPLIANT: YES

LPDDR48G256MX32FBGA, TRAY ROHS COMPLIANT: YES

Supplier's Site Datasheet
IC DRAM 8GBIT 1600MHZ 200WFBGA

IC DRAM 8GBIT 1600MHZ 200WFBGA

Supplier's Site
SDRAM - Mobile LPDDR4 Memory IC 8Gbit 1.6 GHz 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4 Memory IC 8Gbit 1.6 GHz 200-WFBGA (10x14.5)

Buy Now
Integrated Circuits (ICs) - Memory - Memory - MT53B256M32D1NP-062 AAT:C - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory - Memory
MT53B256M32D1NP-062 AAT:C
Integrated Circuits (ICs) - Memory - Memory MT53B256M32D1NP-062 AAT:C
IC DRAM 8GBIT 1.6GHZ 200WFBGA

IC DRAM 8GBIT 1.6GHZ 200WFBGA

Supplier's Site

Technical Specifications

  Win Source Electronics ERSAELECTRONICS PTE. LTD. Newark, An Avnet Company Lingto Electronic Limited Quarktwin Technology Ltd. Shenzhen Shengyu Electronics Technology Limited
Product Category Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 774-MT53B256M32D1NP-062 AAT:C 80AH8203 MT53B256M32D1NP-062 AAT:C MT53B256M32D1NP-062 AAT:C MT53B256M32D1NP-062 AAT:C
Product Name Memory - SDRAM - MT53B256M32D1NP-062 AAT:C 1.6GHZ Memory IC and Storage Component Lpddr48G256Mx32Fbga, Tray Rohs Compliant Micron Memory Memory Integrated Circuits (ICs) - Memory - Memory
Memory Category DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip Volatile; DRAM Chip
Operating Temperature -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F)
Package Type BGA; 200-WFBGA (10x14.5) BGA; Tray BGA; 200-WFBGA
Unlock Full Specs
to access all available technical data

Similar Products

Flash Memory - 1882749P - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category Flash
Density 2048000 kbits
Package Type SOIC; SOIC
View Details
 - 93L422DM - Rochester Electronics
Texas Instruments
Specs
Memory Category SRAM Chip
Package Type DIP; CDIP22
View Details
3 suppliers
Memory - 520966231496 - Quarktwin Technology Ltd.
Infineon Technologies AG
View Details
2 suppliers
 - 27C128-30MD - Rochester Electronics
Rochester Electronics
Specs
Memory Category EPROM
Package Type DIP; SBCDIP
View Details
4 suppliers