Manufacturer: Micron Technology Inc.
Operating Temperature Range: -40°C ~ 85°C (TA)
Features: DRAM Memory IC 576Mb (32M x 18) Parallel 400 MHz 20 ns 144-µBGA (18.5x11)
Package: Tray
Package: 144-TFBGA
Mounting: Surface Mount
Part Status: Obsolete
Family Name: MT49H32M18
Categories: Integrated Circuits (ICs)
Case / Package: 144-µBGA (18.5x11)
ECCN: 3A991B2A
Popularity: High
Fake Threat In the Open Market: 72 pct.
Supply and Demand Status: Balance
Quantity per package: 1000
MSL Level: 3 (168 Hours)
HTSUS: 8542.32.0028
IC DRAM 576MBIT PARALLEL 144UBGA Product overview: MT49H32M18CBM-25 IT:B from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-MT49H32M18CBM-25
IC DRAM 576MBIT PARALLEL 144UBGA
DRAM Memory IC 576Mbit Parallel 400 MHz 20 ns 144-µBGA (18.5x11)
IC DRAM 576MBIT PARALLEL 144UBGA
| Win Source Electronics | ERSAELECTRONICS PTE. LTD. | Shenzhen Shengyu Electronics Technology Limited | Quarktwin Technology Ltd. | Lingto Electronic Limited | |
|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 774-MT49H32M18CBM-25 IT:B | MT49H32M18CBM-25 IT:B | MT49H32M18CBM-25 IT:B | MT49H32M18CBM-25 IT:B | |
| Product Name | Memory - SDRAM - MT49H32M18CBM-25 IT:B | Memory IC and Storage Component | Integrated Circuits (ICs) - Memory - Memory | Memory | Memory |
| Memory Category | DRAM Chip | Volatile; DRAM Chip | Volatile; DRAM Chip | DRAM; DRAM Chip | DRAM; DRAM Chip |
| Operating Temperature | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | ||
| Package Type | BGA; 144-µBGA (18.5x11) | BGA; Tray | BGA | BGA; 144-TFBGA | |
| Access Time | 20 ns | 20 ns | 20 ns |
