Micron Technology, Inc. Memory MT48H32M16LFB4-75 IT:C

Description
SDRAM - Mobile LPSDR Memory IC 512Mb (32M x 16) Parallel 133MHz 5.4ns 54-VFBGA (8x8)
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Description
SDRAM - Mobile LPSDR Memory IC 512Mb (32M x 16) Parallel 133MHz 5.4ns 54-VFBGA (8x8)
Request a Quote
Datasheet
Datasheet Summary
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The MT48H32M16LFB4-75 IT:C is a 512Mb Mobile LPSDR SDRAM memory chip from Quarktwin Technology Ltd. It features a configuration of 32 Meg x 16 with a low operating voltage of 1.8V for both VDD and VDDQ. The device supports a cycle time of 7.5ns at a CAS latency of 3, with an access time of 5.4ns. It operates within an industrial temperature range of -40¬8C to +85¬8C, making it suitable for applications requiring higher temperature tolerance. This memory chip is fully synchronous, allowing for internal pipelined operation and enabling column address changes every clock cycle. It includes four internal banks for concurrent operations and supports programmable burst lengths of 1, 2, 4, 8, and continuous. Additional features include auto precharge, self-refresh modes, and a built-in temperature sensor to manage the self-refresh rate. The device is packaged in a 54-ball VFBGA format, measuring 8mm x 8mm, and is compliant with environmental standards as a "green" product. Engineers considering this memory chip should evaluate its specifications against their project requirements, particularly in terms of power consumption, temperature range, and performance characteristics.

Datasheet Summary
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The MT48H32M16LFB4-75 IT:C is a 512Mb Mobile LPSDR SDRAM memory chip from Quarktwin Technology Ltd. It features a configuration of 32 Meg x 16 with a low operating voltage of 1.8V for both VDD and VDDQ. The device supports a cycle time of 7.5ns at a CAS latency of 3, with an access time of 5.4ns. It operates within an industrial temperature range of -40¬8C to +85¬8C, making it suitable for applications requiring higher temperature tolerance. This memory chip is fully synchronous, allowing for internal pipelined operation and enabling column address changes every clock cycle. It includes four internal banks for concurrent operations and supports programmable burst lengths of 1, 2, 4, 8, and continuous. Additional features include auto precharge, self-refresh modes, and a built-in temperature sensor to manage the self-refresh rate. The device is packaged in a 54-ball VFBGA format, measuring 8mm x 8mm, and is compliant with environmental standards as a "green" product. Engineers considering this memory chip should evaluate its specifications against their project requirements, particularly in terms of power consumption, temperature range, and performance characteristics.

Suppliers

Company
Product
Description
Supplier Links
Memory - 557-1596-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - Mobile LPSDR Memory IC 512Mb (32M x 16) Parallel 133MHz 5.4ns 54-VFBGA (8x8)

SDRAM - Mobile LPSDR Memory IC 512Mb (32M x 16) Parallel 133MHz 5.4ns 54-VFBGA (8x8)

Buy Now Datasheet
SDRAM - Mobile LPSDR Memory IC 512Mbit Parallel 133 MHz 5.4 ns 54-VFBGA (8x8)

SDRAM - Mobile LPSDR Memory IC 512Mbit Parallel 133 MHz 5.4 ns 54-VFBGA (8x8)

Buy Now Datasheet
Integrated Circuits (ICs) - Memory - Memory - MT48H32M16LFB4-75 IT:C - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory - Memory
MT48H32M16LFB4-75 IT:C
Integrated Circuits (ICs) - Memory - Memory MT48H32M16LFB4-75 IT:C
IC DRAM 512MBIT PAR 54VFBGA

IC DRAM 512MBIT PAR 54VFBGA

Supplier's Site
IC DRAM 512MBIT PARALLEL 54VFBGA

IC DRAM 512MBIT PARALLEL 54VFBGA

Supplier's Site Datasheet

Technical Specifications

  DigiKey Quarktwin Technology Ltd. Shenzhen Shengyu Electronics Technology Limited Lingto Electronic Limited
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 557-1596-ND MT48H32M16LFB4-75 IT:C MT48H32M16LFB4-75 IT:C MT48H32M16LFB4-75 IT:C
Product Name Memory Memory Integrated Circuits (ICs) - Memory - Memory Memory
Memory Category DRAM Chip DRAM; DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip
Operating Temperature -40 to 85 C (-40 to 185 F) -40 to 85 C (-40 to 185 F)
Density 512000 kbits 512000 kbits 512000 kbits 512000 kbits
Package Type 54-VFBGA BGA; 54-VFBGA BGA
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