Micron Technology, Inc. IT infrastructure Memory MT29F4T08EULEEM4-R:E

Description
Category: IT infrastructure Memory Manufacturer: Micron Technology Inc.
Request a Quote
Description
Category: IT infrastructure Memory Manufacturer: Micron Technology Inc.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
IT infrastructure Memory -  - Win Source Electronics
Laguna Hills, CA, United States
IT infrastructure Memory
IT infrastructure Memory
Category: IT infrastructure Memory Manufacturer: Micron Technology Inc.

Category: IT infrastructure Memory
Manufacturer: Micron Technology Inc.

Buy Now
Shenzhen, China
Integrated Circuits (ICs) - Memory - Memory
MT29F4T08EULEEM4-R:E
Integrated Circuits (ICs) - Memory - Memory MT29F4T08EULEEM4-R:E
TLC 4T 512GX8 LBGA 8DP

TLC 4T 512GX8 LBGA 8DP

Supplier's Site

Technical Specifications

  Win Source Electronics Acme Chip Technology Co., Limited
Product Category Memory Chips Memory Chips
Product Number MT29F4T08EULEEM4-R:E
Product Name IT infrastructure Memory Integrated Circuits (ICs) - Memory - Memory
Memory Category Flash Flash; FLASH
Unlock Full Specs
to access all available technical data

Similar Products

 - 93425DMQB40 - Rochester Electronics
Specs
Memory Category SRAM Chip
Logic Family TTL
Package Type DIP; CDIP16
View Details
3 suppliers
 - 27S29DC - Rochester Electronics
Rochester Electronics
Specs
Memory Category PROM
Package Type DIP; CDIP
View Details
4 suppliers
Memories - Radiation hardened and high-reliability memories - Space Memories - 5962F1120202VXA - 5962F1120202VXA - Infineon Technologies AG
Specs
Operating Temperature -55 to 125 C (-67 to 257 F)
Density 72000 kbits
Number of Words 4 k
View Details
Memory - MYX6M4424 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category MOSFET
Operating Temperature -55 to 125 C (-67 to 257 F)
Package Type CDIP-8LD
View Details