Micron Technology, Inc. IT infrastructure Memory MT29F4T08EMLCHD4-T:C

Description
Category: IT infrastructure Memory Manufacturer: Micron Technology Inc.
Request a Quote
Description
Category: IT infrastructure Memory Manufacturer: Micron Technology Inc.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
IT infrastructure Memory -  - Win Source Electronics
Laguna Hills, CA, United States
IT infrastructure Memory
IT infrastructure Memory
Category: IT infrastructure Memory Manufacturer: Micron Technology Inc.

Category: IT infrastructure Memory
Manufacturer: Micron Technology Inc.

Buy Now
Shenzhen, China
Integrated Circuits (ICs) - Memory - Memory
MT29F4T08EMLCHD4-T:C
Integrated Circuits (ICs) - Memory - Memory MT29F4T08EMLCHD4-T:C
TLC 4T 512GX8 FBGA QDP

TLC 4T 512GX8 FBGA QDP

Supplier's Site
Memory - MT29F4T08EMLCHD4-T:C - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Memory IC

Memory IC

Buy Now

Technical Specifications

  Win Source Electronics Acme Chip Technology Co., Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips
Product Number MT29F4T08EMLCHD4-T:C MT29F4T08EMLCHD4-T:C
Product Name IT infrastructure Memory Integrated Circuits (ICs) - Memory - Memory Memory
Unlock Full Specs
to access all available technical data

Similar Products

Memory IC and Storage Component - 736-DP8409AD - ERSAELECTRONICS PTE. LTD.
Specs
Memory Category DRAM Chip
Operating Temperature 0 to 70 C (32 to 158 F)
Package Type Bulk
View Details
2 suppliers
 - 27C128-30MD - Rochester Electronics
Specs
Memory Category EPROM
Package Type DIP; SBCDIP
View Details
4 suppliers
Memory - 40060108-001 - Quarktwin Technology Ltd.
Infineon Technologies AG
View Details
2 suppliers
Memory - MYX4DD3K128M72PBG2 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category DDR3
Operating Temperature -55 to 125 C (-67 to 257 F)
Density 1024000 kbits
View Details