Micron Technology, Inc. Memory - SDRAM - EDB4064B4PB-1D-F-D EDB4064B4PB-1D-F-D

Description
Manufacturer: Micron Technology Inc. Win Source Part Number: 917820-EDB4064B4PB-1 D-F-D Operating Temperature Range: -30°C ~ 85°C (TC) Features: SDRAM - Mobile LPDDR2 Memory IC 4Gb (64M x 64) Parallel 533 MHz 216-WFBGA (12x12) Package: Bulk Package: 216-WFBGA Mounting: Surface Mount Part Status: Obsolete Categories: Integrated Circuits (ICs) Case / Package: 216-WFBGA (12x12) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 83 pct. Supply and Demand Status: Balance Quantity per package: 1680 MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.32.0036
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Description
Manufacturer: Micron Technology Inc. Win Source Part Number: 917820-EDB4064B4PB-1 D-F-D Operating Temperature Range: -30°C ~ 85°C (TC) Features: SDRAM - Mobile LPDDR2 Memory IC 4Gb (64M x 64) Parallel 533 MHz 216-WFBGA (12x12) Package: Bulk Package: 216-WFBGA Mounting: Surface Mount Part Status: Obsolete Categories: Integrated Circuits (ICs) Case / Package: 216-WFBGA (12x12) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 83 pct. Supply and Demand Status: Balance Quantity per package: 1680 MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.32.0036
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - SDRAM - EDB4064B4PB-1D-F-D - 917820-EDB4064B4PB-1D-F-D - Win Source Electronics
Laguna Hills, CA, United States
Memory - SDRAM - EDB4064B4PB-1D-F-D
917820-EDB4064B4PB-1D-F-D
Memory - SDRAM - EDB4064B4PB-1D-F-D 917820-EDB4064B4PB-1D-F-D
Manufacturer: Micron Technology Inc. Win Source Part Number: 917820-EDB4064B4PB-1 D-F-D Operating Temperature Range: -30°C ~ 85°C (TC) Features: SDRAM - Mobile LPDDR2 Memory IC 4Gb (64M x 64) Parallel 533 MHz 216-WFBGA (12x12) Package: Bulk Package: 216-WFBGA Mounting: Surface Mount Part Status: Obsolete Categories: Integrated Circuits (ICs) Case / Package: 216-WFBGA (12x12) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 83 pct. Supply and Demand Status: Balance Quantity per package: 1680 MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.32.0036

Manufacturer: Micron Technology Inc.
Win Source Part Number: 917820-EDB4064B4PB-1D-F-D
Operating Temperature Range: -30°C ~ 85°C (TC)
Features: SDRAM - Mobile LPDDR2 Memory IC 4Gb (64M x 64) Parallel 533 MHz 216-WFBGA (12x12)
Package: Bulk
Package: 216-WFBGA
Mounting: Surface Mount
Part Status: Obsolete
Categories: Integrated Circuits (ICs)
Case / Package: 216-WFBGA (12x12)
ECCN: EAR99
Popularity: High
Fake Threat In the Open Market: 83 pct.
Supply and Demand Status: Balance
Quantity per package: 1680
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.32.0036

Buy Now Datasheet
Memory IC and Storage Component - 774-EDB4064B4PB-1D-F-D - ERSAELECTRONICS PTE. LTD.
Singapore, Singapore
Memory IC and Storage Component
774-EDB4064B4PB-1D-F-D
Memory IC and Storage Component 774-EDB4064B4PB-1D-F-D
IC DRAM 4GBIT PAR 216WFBGA Product overview: EDB4064B4PB-1D-F-D from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-EDB4064B4PB-1D-F -D can be used for catalog matching and distributor lookup.

IC DRAM 4GBIT PAR 216WFBGA Product overview: EDB4064B4PB-1D-F-D from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-EDB4064B4PB-1D-F-D can be used for catalog matching and distributor lookup.

Supplier's Site Datasheet
Memory - EDB4064B4PB-1D-F-D - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - Mobile LPDDR2 Memory IC 4Gbit Parallel 533 MHz 216-WFBGA (12x12)

SDRAM - Mobile LPDDR2 Memory IC 4Gbit Parallel 533 MHz 216-WFBGA (12x12)

Buy Now
Integrated Circuits (ICs) - Memory - Memory - EDB4064B4PB-1D-F-D - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory - Memory
EDB4064B4PB-1D-F-D
Integrated Circuits (ICs) - Memory - Memory EDB4064B4PB-1D-F-D
IC DRAM 4GBIT PAR 216WFBGA

IC DRAM 4GBIT PAR 216WFBGA

Supplier's Site
IC DRAM 4GBIT PARALLEL 216WFBGA

IC DRAM 4GBIT PARALLEL 216WFBGA

Supplier's Site Datasheet

Technical Specifications

  Win Source Electronics ERSAELECTRONICS PTE. LTD. Quarktwin Technology Ltd. Shenzhen Shengyu Electronics Technology Limited Lingto Electronic Limited
Product Category Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 917820-EDB4064B4PB-1D-F-D 774-EDB4064B4PB-1D-F-D EDB4064B4PB-1D-F-D EDB4064B4PB-1D-F-D EDB4064B4PB-1D-F-D
Product Name Memory - SDRAM - EDB4064B4PB-1D-F-D Memory IC and Storage Component Memory Integrated Circuits (ICs) - Memory - Memory Memory
Memory Category DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip
Operating Temperature -30 to 85 C (-22 to 185 F) -30 to 85 C (-22 to 185 F) -30 to 85 C (-22 to 185 F)
Package Type BGA; 216-WFBGA (12x12) BGA; Bulk BGA; 216-WFBGA
Access Time 5.5 ns
Density 4000000 kbits 4000000 kbits 4000000 kbits 4000000 kbits
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