SST39VF401C -- 4MB 2.7-3.6V PARALLEL FLASH
Microchip Technology, Inc.
4Mb 2.7-3.6V Parallel Flash
SST39VF401C
Description
Additional Features
Organized as 256K x16
Single Voltage Read and Write Operations– 2.7-3.6V for SST39VF401C/402C– 3.0-3.6V for SST39LF401C/402C
Superior Reliability– Endurance: 100,000 Cycles (Typical)– Greater than 100 years Data Retention
Low Power Consumption (typical values at 5 MHz)– Active Current: 5 mA (typical)– Standby Current: 3 µA (typical)– Auto Low Power Mode: 3 µA (typical)
Hardware Block-Protection/WP# Input Pin– Top Block-Protection (top 8 KWord)– Bottom Block-Protection (bottom 8 KWord)
Sector-Erase Capability– Uniform 2 KWord sectors
Block-Erase Capability– Flexible block architecture; one 8-, two 4-, one 16-, andseven 32-KWord blocks
Chip-Erase Capability
Erase-Suspend/Erase-
Resume Capabilities
Hardware Reset Pin (RST#)
Latched Address and Data
Security-ID Feature– SST: 128 bits; User: 128 words
Fast Read Access Time:– 70 ns for SST39VF401C/402C– 55 ns for SST39LF401C/402C
Fast Erase and Word-Program:– Sector-Erase Time: 18 ms (typical)– Block-Erase Time: 18 ms (typical)– Chip-Erase Time: 40 ms (typical)– Word-Program Time: 7 µs (typical)
Automatic Write Timing– Internal VPP Generation
End-of-Write Detection– Toggle Bits– Data# Polling– Ready/Busy# Pin
CMOS I/O Compatibility
JEDEC Standard– Flash EEPROM Pinouts and command sets
Packages Available– 48-lead TSOP (12mm x 20mm)– 48-ball TFBGA (6mm x 8mm)– 48-ball WFBGA (4mm x 6mm)
All devices are RoHS compliant
Microchip Technology, Inc.
Datasheet
Description
Additional Features
Organized as 256K x16
Single Voltage Read and Write Operations– 2.7-3.6V for SST39VF401C/402C– 3.0-3.6V for SST39LF401C/402C
Superior Reliability– Endurance: 100,000 Cycles (Typical)– Greater than 100 years Data Retention
Low Power Consumption (typical values at 5 MHz)– Active Current: 5 mA (typical)– Standby Current: 3 µA (typical)– Auto Low Power Mode: 3 µA (typical)
Hardware Block-Protection/WP# Input Pin– Top Block-Protection (top 8 KWord)– Bottom Block-Protection (bottom 8 KWord)
Sector-Erase Capability– Uniform 2 KWord sectors
Block-Erase Capability– Flexible block architecture; one 8-, two 4-, one 16-, andseven 32-KWord blocks
Chip-Erase Capability
Erase-Suspend/Erase-
Resume Capabilities
Hardware Reset Pin (RST#)
Latched Address and Data
Security-ID Feature– SST: 128 bits; User: 128 words
Fast Read Access Time:– 70 ns for SST39VF401C/402C– 55 ns for SST39LF401C/402C
Fast Erase and Word-Program:– Sector-Erase Time: 18 ms (typical)– Block-Erase Time: 18 ms (typical)– Chip-Erase Time: 40 ms (typical)– Word-Program Time: 7 µs (typical)
Automatic Write Timing– Internal VPP Generation
End-of-Write Detection– Toggle Bits– Data# Polling– Ready/Busy# Pin
CMOS I/O Compatibility
JEDEC Standard– Flash EEPROM Pinouts and command sets
Packages Available– 48-lead TSOP (12mm x 20mm)– 48-ball TFBGA (6mm x 8mm)– 48-ball WFBGA (4mm x 6mm)
All devices are RoHS compliant
Datasheet
Suppliers
Additional Features
Organized as 256K x16
Single Voltage Read and Write Operations– 2.7-3.6V for SST39VF401C/402C– 3.0-3.6V for SST39LF401C/402C
Superior Reliability– Endurance: 100,000 Cycles (Typical)– Greater than 100 years Data Retention
Low Power Consumption (typical values at 5 MHz)– Active Current: 5 mA (typical)– Standby Current: 3 µA (typical)– Auto Low Power Mode: 3 µA (typical)
Hardware Block-Protection/WP# Input Pin– Top Block-Protection (top 8 KWord)– Bottom Block-Protection (bottom 8 KWord)
Sector-Erase Capability– Uniform 2 KWord sectors
Block-Erase Capability– Flexible block architecture; one 8-, two 4-, one 16-, andseven 32-KWord blocks
Chip-Erase Capability
Erase-Suspend/Erase-
Resume Capabilities
Hardware Reset Pin (RST#)
Latched Address and Data
Security-ID Feature– SST: 128 bits; User: 128 words
Fast Read Access Time:– 70 ns for SST39VF401C/402C– 55 ns for SST39LF401C/402C
Fast Erase and Word-Program:– Sector-Erase Time: 18 ms (typical)– Block-Erase Time: 18 ms (typical)– Chip-Erase Time: 40 ms (typical)– Word-Program Time: 7 µs (typical)
Automatic Write Timing– Internal VPP Generation
End-of-Write Detection– Toggle Bits– Data# Polling– Ready/Busy# Pin
CMOS I/O Compatibility
JEDEC Standard– Flash EEPROM Pinouts and command sets
Packages Available– 48-lead TSOP (12mm x 20mm)– 48-ball TFBGA (6mm x 8mm)– 48-ball WFBGA (4mm x 6mm)
All devices are RoHS compliant
Additional Features
Organized as 256K x16
Single Voltage Read and Write Operations– 2.7-3.6V for SST39VF401C/402C– 3.0-3.6V for SST39LF401C/402C
Superior Reliability– Endurance: 100,000 Cycles (Typical)– Greater than 100 years Data Retention
Low Power Consumption (typical values at 5 MHz)– Active Current: 5 mA (typical)– Standby Current: 3 µA (typical)– Auto Low Power Mode: 3 µA (typical)
Hardware Block-Protection/WP# Input Pin– Top Block-Protection (top 8 KWord)– Bottom Block-Protection (bottom 8 KWord)
Sector-Erase Capability– Uniform 2 KWord sectors
Block-Erase Capability– Flexible block architecture; one 8-, two 4-, one 16-, andseven 32-KWord blocks
Chip-Erase Capability
Erase-Suspend/Erase- Resume Capabilities
Hardware Reset Pin (RST#)
Latched Address and Data
Security-ID Feature– SST: 128 bits; User: 128 words
Fast Read Access Time:– 70 ns for SST39VF401C/402C– 55 ns for SST39LF401C/402C
Fast Erase and Word-Program:– Sector-Erase Time: 18 ms (typical)– Block-Erase Time: 18 ms (typical)– Chip-Erase Time: 40 ms (typical)– Word-Program Time: 7 µs (typical)
Automatic Write Timing– Internal VPP Generation
End-of-Write Detection– Toggle Bits– Data# Polling– Ready/Busy# Pin
CMOS I/O Compatibility
JEDEC Standard– Flash EEPROM Pinouts and command sets
Packages Available– 48-lead TSOP (12mm x 20mm)– 48-ball TFBGA (6mm x 8mm)– 48-ball WFBGA (4mm x 6mm)
All devices are RoHS compliant
Supplier's Site
Datasheet
Technical Specifications
Product Category
Memory Chips
Product Number
SST39VF401C
Product Name
4Mb 2.7-3.6V Parallel Flash
Memory Category
Flash
Access Time
70 ns
Data Retention
100 years
Endurance
100000 Write/Erase Cycles
Unlock Full Specs
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