Features
SiC Schottky Diode
SiC MOSFET
Low stray inductance
Lead frames for power connections
SI3N4 substrate for improved thermal performance
AlSiC base plate for extended reliability and reduced weight
Extended storage temperature range
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction-to-case thermal resistance
RoHS compliant
Applications
Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA) systems
High reliability Power Core Module (PCM)
Modular power module for Power Drive Electronic (PDE)
Richardson RFPD
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Datasheet
Description
Features
SiC Schottky Diode
SiC MOSFET
Low stray inductance
Lead frames for power connections
SI3N4 substrate for improved thermal performance
AlSiC base plate for extended reliability and reduced weight
Extended storage temperature range
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction-to-case thermal resistance
RoHS compliant
Applications
Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA) systems
High reliability Power Core Module (PCM)
Modular power module for Power Drive Electronic (PDE)
Features
SiC Schottky Diode
SiC MOSFET
Low stray inductance
Lead frames for power connections
SI3N4 substrate for improved thermal performance
AlSiC base plate for extended reliability and reduced weight
Extended storage temperature range
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction-to-case thermal resistance
RoHS compliant
Applications
Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA) systems
High reliability Power Core Module (PCM)
Modular power module for Power Drive Electronic (PDE)
Features
SiC Schottky Diode
SiC MOSFET
Low stray inductance
Lead frames for power connections
SI3N4 substrate for improved thermal performance
AlSiC base plate for extended reliability and reduced weight
Extended storage temperature range
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction-to-case thermal resistance
RoHS compliant
Applications
Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA) systems
High reliability Power Core Module (PCM)
Modular power module for Power Drive Electronic (PDE)