Features
SiC Schottky Diode
SiC MOSFET
Low stray inductance
Lead frames for power connections
SI3N4 substrate for improved thermal performance
AlSiC base plate for extended reliability and reduced weight
Extended storage temperature range
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction-to-case thermal resistance
RoHS compliant
Applications
Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA) systems
High reliability Power Core Module (PCM)
Modular power module for Power Drive Electronic (PDE)
Richardson RFPD
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Description
Features
SiC Schottky Diode
SiC MOSFET
Low stray inductance
Lead frames for power connections
SI3N4 substrate for improved thermal performance
AlSiC base plate for extended reliability and reduced weight
Extended storage temperature range
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction-to-case thermal resistance
RoHS compliant
Applications
Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA) systems
High reliability Power Core Module (PCM)
Modular power module for Power Drive Electronic (PDE)
Request a Quote
Email Supplier
Datasheet
Datasheet Summary Powered by GS/AI
The MSCSM70XM19CTYZBNMG is a three-phase bridge, brake, soft start, and solenoid power module using silicon carbide MOSFETs and Schottky diodes, designed for high-reliability electro-mechanical and electro-hydrostatic actuator systems. It features an AlSiC base plate, SiN substrate, and solderable terminals for direct heatsink mounting. The module weighs 150 g and supports a junction temperature range of -55 °C to 175 °C. Each SiC MOSFET has a 700 V drain-source voltage rating, 110 A continuous drain current at 25 °C, and a typical ON resistance of 15 mΩ at 25 °C. An internal PTC thermistor provides temperature monitoring with a resistance of 1000 Ω at 0 °C. The package offers 4000 V RMS isolation between terminals and case, and 1500 V RMS isolation for the thermistor. It is RoHS compliant.
Datasheet Summary Powered by GS/AI
The MSCSM70XM19CTYZBNMG is a three-phase bridge, brake, soft start, and solenoid power module using silicon carbide MOSFETs and Schottky diodes, designed for high-reliability electro-mechanical and electro-hydrostatic actuator systems. It features an AlSiC base plate, SiN substrate, and solderable terminals for direct heatsink mounting. The module weighs 150 g and supports a junction temperature range of -55 °C to 175 °C. Each SiC MOSFET has a 700 V drain-source voltage rating, 110 A continuous drain current at 25 °C, and a typical ON resistance of 15 mΩ at 25 °C. An internal PTC thermistor provides temperature monitoring with a resistance of 1000 Ω at 0 °C. The package offers 4000 V RMS isolation between terminals and case, and 1500 V RMS isolation for the thermistor. It is RoHS compliant.
Features
SiC Schottky Diode
SiC MOSFET
Low stray inductance
Lead frames for power connections
SI3N4 substrate for improved thermal performance
AlSiC base plate for extended reliability and reduced weight
Extended storage temperature range
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction-to-case thermal resistance
RoHS compliant
Applications
Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA) systems
High reliability Power Core Module (PCM)
Modular power module for Power Drive Electronic (PDE)
Features
SiC Schottky Diode
SiC MOSFET
Low stray inductance
Lead frames for power connections
SI3N4 substrate for improved thermal performance
AlSiC base plate for extended reliability and reduced weight
Extended storage temperature range
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction-to-case thermal resistance
RoHS compliant
Applications
Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA) systems
High reliability Power Core Module (PCM)
Modular power module for Power Drive Electronic (PDE)
