Features
SiC Schottky Diode
IGBT4
Low stray inductance
Lead frames for power connections
SI3N4 substrate for improved thermal performance
AlSiC base plate for extended reliability and reduced weight
Extended storage temperature range
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction-to-case thermal resistance
RoHS compliant
Applications
Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA) systems
High reliability Power Core Module (PCM)
Modular power module for Power Drive Electronic (PDE)
Richardson RFPD
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Description
Features
SiC Schottky Diode
IGBT4
Low stray inductance
Lead frames for power connections
SI3N4 substrate for improved thermal performance
AlSiC base plate for extended reliability and reduced weight
Extended storage temperature range
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction-to-case thermal resistance
RoHS compliant
Applications
Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA) systems
High reliability Power Core Module (PCM)
Modular power module for Power Drive Electronic (PDE)
Request a Quote
Email Supplier
Datasheet
Datasheet Summary Powered by GS/AI
The MSCGLQ50X120CTYZBNMG is a three-phase bridge, brake, soft start, and solenoid power module incorporating silicon carbide Schottky diodes and IGBT4 transistors in an isolated package with an AlSiC base plate and Si3N4 substrate for enhanced thermal performance. It has a compact design with a weight of 150 g and supports direct mounting to a heatsink. The device operates with a junction temperature range of -55 °C to 175 °C, and the case temperature range is -55 °C to 125 °C. It features internal thermistor-based temperature monitoring with 1000 Ω resistance at 0 °C and meets RoHS compliance. The package supports 4000 V RMS isolation voltage between terminals and case, and is rated for a mounting torque of 3 to 5 N·m using M6 screws. The module is designed for high-reliability applications including electro-mechanical and electro-hydrostatic actuators, power core modules, and modular power drives.
Datasheet Summary Powered by GS/AI
The MSCGLQ50X120CTYZBNMG is a three-phase bridge, brake, soft start, and solenoid power module incorporating silicon carbide Schottky diodes and IGBT4 transistors in an isolated package with an AlSiC base plate and Si3N4 substrate for enhanced thermal performance. It has a compact design with a weight of 150 g and supports direct mounting to a heatsink. The device operates with a junction temperature range of -55 °C to 175 °C, and the case temperature range is -55 °C to 125 °C. It features internal thermistor-based temperature monitoring with 1000 Ω resistance at 0 °C and meets RoHS compliance. The package supports 4000 V RMS isolation voltage between terminals and case, and is rated for a mounting torque of 3 to 5 N·m using M6 screws. The module is designed for high-reliability applications including electro-mechanical and electro-hydrostatic actuators, power core modules, and modular power drives.
Features
SiC Schottky Diode
IGBT4
Low stray inductance
Lead frames for power connections
SI3N4 substrate for improved thermal performance
AlSiC base plate for extended reliability and reduced weight
Extended storage temperature range
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction-to-case thermal resistance
RoHS compliant
Applications
Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA) systems
High reliability Power Core Module (PCM)
Modular power module for Power Drive Electronic (PDE)
Features
SiC Schottky Diode
IGBT4
Low stray inductance
Lead frames for power connections
SI3N4 substrate for improved thermal performance
AlSiC base plate for extended reliability and reduced weight
Extended storage temperature range
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Solderable terminals for easy PCB mounting
Direct mounting to heatsink (isolated package)
Low junction-to-case thermal resistance
RoHS compliant
Applications
Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA) systems
High reliability Power Core Module (PCM)
Modular power module for Power Drive Electronic (PDE)
