Microchip Technology, Inc. Memory AT28C010-25FM/883

Description
EEPROM Memory IC 1Mb (128K x 8) Parallel 250ns 32-FlatPack, Ceramic Bottom-Brazed
Request a Quote Datasheet
Description
EEPROM Memory IC 1Mb (128K x 8) Parallel 250ns 32-FlatPack, Ceramic Bottom-Brazed
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - AT28C010-25FM/883-ND - DigiKey
Thief River Falls, MN, United States
EEPROM Memory IC 1Mb (128K x 8) Parallel 250ns 32-FlatPack, Ceramic Bottom-Brazed

EEPROM Memory IC 1Mb (128K x 8) Parallel 250ns 32-FlatPack, Ceramic Bottom-Brazed

Buy Now Datasheet
Memory - EEPROM - AT28C010-25FM/883 - 911886-AT28C010-25FM/883 - Win Source Electronics
Laguna Hills, CA, United States
Memory - EEPROM - AT28C010-25FM/883
911886-AT28C010-25FM/883
Memory - EEPROM - AT28C010-25FM/883 911886-AT28C010-25FM/883
Manufacturer: Microchip Technology Win Source Part Number: 911886-AT28C010-25FM /883 Operating Temperature Range: -55°C ~ 125°C (TC) Features: EEPROM Memory IC 1Mb (128K x 8) Parallel 250 ns 32-Flatpack, Ceramic Bottom-Brazed Package: 32-CFlatpack Package: Tube Mounting: Surface Mount Family Name: AT28C010 Categories: Integrated Circuits (ICs) Case / Package: 32-Flatpack, Ceramic Bottom-Brazed ECCN: 3A001A2C Popularity: High Fake Threat In the Open Market: 70 pct. Supply and Demand Status: Balance Quantity per package: 15 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 22 Weeks REACH Status: REACH Unaffected HTSUS: 8542.32.0051

Manufacturer: Microchip Technology
Win Source Part Number: 911886-AT28C010-25FM/883
Operating Temperature Range: -55°C ~ 125°C (TC)
Features: EEPROM Memory IC 1Mb (128K x 8) Parallel 250 ns 32-Flatpack, Ceramic Bottom-Brazed
Package: 32-CFlatpack
Package: Tube
Mounting: Surface Mount
Family Name: AT28C010
Categories: Integrated Circuits (ICs)
Case / Package: 32-Flatpack, Ceramic Bottom-Brazed
ECCN: 3A001A2C
Popularity: High
Fake Threat In the Open Market: 70 pct.
Supply and Demand Status: Balance
Quantity per package: 15
MSL Level: 3 (168 Hours)
Estimated Pruduction Lead Time: 22 Weeks
REACH Status: REACH Unaffected
HTSUS: 8542.32.0051

Buy Now Datasheet
Memory - AT28C010-25FM/883 - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
EEPROM Memory IC 1Mbit Parallel 250 ns 32-FlatPack, Ceramic Bottom-Brazed

EEPROM Memory IC 1Mbit Parallel 250 ns 32-FlatPack, Ceramic Bottom-Brazed

Buy Now Datasheet
IC EEPROM 1MBIT PAR 32FLATPACK

IC EEPROM 1MBIT PAR 32FLATPACK

Supplier's Site Datasheet
Integrated Circuits (ICs) - Memory - Memory - AT28C010-25FM/883 - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory - Memory
AT28C010-25FM/883
Integrated Circuits (ICs) - Memory - Memory AT28C010-25FM/883
IC EEPROM 1MBIT PAR 32FLATPACK

IC EEPROM 1MBIT PAR 32FLATPACK

Supplier's Site

Technical Specifications

  DigiKey Win Source Electronics Quarktwin Technology Ltd. Lingto Electronic Limited Shenzhen Shengyu Electronics Technology Limited
Product Category Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips
Product Number AT28C010-25FM/883-ND 911886-AT28C010-25FM/883 AT28C010-25FM/883 AT28C010-25FM/883 AT28C010-25FM/883
Product Name Memory Memory - EEPROM - AT28C010-25FM/883 Memory Memory Integrated Circuits (ICs) - Memory - Memory
Memory Category EEPROM EEPROM EEPROM; EEPROM EEPROM; EEPROM EEPROM; Non-Volatile
Operating Temperature -55 to 125 C (-67 to 257 F) -55 to 125 C (-67 to 257 F) -55 to 125 C (-67 to 257 F)
Density 1000 kbits 1000 kbits 1000 kbits 1000 kbits
Package Type 32-CFlatPack 32-Flatpack, Ceramic Bottom-Brazed 32-CFlatPack
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