APTM100H45STG-MODULE -- 1000V/FULL BRIDGE + SERIES AND PARALLEL DIODES/SI
Microchip Technology, Inc.1000V/Full bridge + series and parallel diodes/SiAPTM100H45STG-Module
Description
MOSFETs
Low RDSon
Low input and Miller capacitance
Low gate charge
Avalanche energy rated
Very rugged
Kelvin source for easy drive
Low stray inductance
Outstanding performance at high frequency operation
Direct mounting to heatsink (isolated package)
Internal thermistor for temperature monitoring (optional)
Low junction to case thermal resistance
RoHS Compliant
Additional Features
Configuration: Full bridge + series and parallel diodes
VDSS (V): 1000
RDSon (mR) typ: 450
Current (A) Tc=80C: 13
Silicon type: MOSFET
Package: SP4
Microchip Technology, Inc.
Done
Datasheet
Description
MOSFETs
Low RDSon
Low input and Miller capacitance
Low gate charge
Avalanche energy rated
Very rugged
Kelvin source for easy drive
Low stray inductance
Outstanding performance at high frequency operation
Direct mounting to heatsink (isolated package)
Internal thermistor for temperature monitoring (optional)
Low junction to case thermal resistance
RoHS Compliant
Additional Features
Configuration: Full bridge + series and parallel diodes
VDSS (V): 1000
RDSon (mR) typ: 450
Current (A) Tc=80C: 13
Silicon type: MOSFET
Package: SP4
MOSFETs
Low RDSon
Low input and Miller capacitance
Low gate charge
Avalanche energy rated
Very rugged
Kelvin source for easy drive
Low stray inductance
Outstanding performance at high frequency operation
Direct mounting to heatsink (isolated package)
Internal thermistor for temperature monitoring (optional)
Low junction to case thermal resistance
RoHS Compliant
Additional Features
Configuration: Full bridge + series and parallel diodes
VDSS (V): 1000
RDSon (mR) typ: 450
Current (A) Tc=80C: 13
Silicon type: MOSFET
Package: SP4
MOSFETs
Low RDSon
Low input and Miller capacitance
Low gate charge
Avalanche energy rated
Very rugged
Kelvin source for easy drive
Low stray inductance
Outstanding performance at high frequency operation
Direct mounting to heatsink (isolated package)
Internal thermistor for temperature monitoring (optional)
Low junction to case thermal resistance
RoHS Compliant
Additional Features
Configuration: Full bridge + series and parallel diodes
