Microchip Technology, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) A2F500M3G-FGG256I

Description
Win Source Part Number: 1024337-A2F500M3G-FG G256I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: SmartFusion® Core Processor: ARM® Cortex®-M3 Speed: 80MHz Package: Tray Standard Package: 90 Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Number of I/O: MCU - 25, FPGA - 66 RAM Size: 64KB Flash Size: 512KB Architecture: MCU, FPGA Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Temperature Range - Operating: -40°C ~ 100°C (TJ) ECCN: 3A991D Fake Threat In the Open Market: 69 pct. MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: Microchip Technology Base Product Number: A2F500
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Description
Win Source Part Number: 1024337-A2F500M3G-FG G256I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: SmartFusion® Core Processor: ARM® Cortex®-M3 Speed: 80MHz Package: Tray Standard Package: 90 Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Number of I/O: MCU - 25, FPGA - 66 RAM Size: 64KB Flash Size: 512KB Architecture: MCU, FPGA Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Temperature Range - Operating: -40°C ~ 100°C (TJ) ECCN: 3A991D Fake Threat In the Open Market: 69 pct. MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: Microchip Technology Base Product Number: A2F500
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Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1024337-A2F500M3G-FGG256I - Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1024337-A2F500M3G-FGG256I
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1024337-A2F500M3G-FGG256I
Win Source Part Number: 1024337-A2F500M3G-FG G256I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: SmartFusion® Core Processor: ARM® Cortex®-M3 Speed: 80MHz Package: Tray Standard Package: 90 Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Number of I/O: MCU - 25, FPGA - 66 RAM Size: 64KB Flash Size: 512KB Architecture: MCU, FPGA Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Temperature Range - Operating: -40°C ~ 100°C (TJ) ECCN: 3A991D Fake Threat In the Open Market: 69 pct. MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: Microchip Technology Base Product Number: A2F500

Win Source Part Number: 1024337-A2F500M3G-FGG256I
Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Series: SmartFusion®
Core Processor: ARM® Cortex®-M3
Speed: 80MHz
Package: Tray
Standard Package: 90
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Number of I/O: MCU - 25, FPGA - 66
RAM Size: 64KB
Flash Size: 512KB
Architecture: MCU, FPGA
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Package / Case: 256-LBGA
Supplier Device Package: 256-FPBGA (17x17)
Temperature Range - Operating: -40°C ~ 100°C (TJ)
ECCN: 3A991D
Fake Threat In the Open Market: 69 pct.
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: Microchip Technology
Base Product Number: A2F500

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Technical Specifications

  Win Source Electronics
Product Category Programmable Logic Devices (PLD)
Product Number 1024337-A2F500M3G-FGG256I
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Operating Temperature -40 to 100 C (-40 to 212 F)
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