MG Chemicals Silicone Heat Transfer Compound, 495Ml; Dispensing Method Mg Chemicals 846-1P

Description
SILICONE HEAT TRANSFER COMPOUND, 495ML; Dispensing Method:Jar; Volume:495ml; Weight:-; Product Range:846 Series; SVHC:No SVHC (15-Jan-2019) RoHS Compliant: Yes
  • Silicone Heat Transfer Compound, 495Ml; Dispensing Method Mg Chemicals - 61AC5491 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
SILICONE HEAT TRANSFER COMPOUND, 495ML; Dispensing Method:Jar; Volume:495ml; Weight:-; Product Range:846 Series; SVHC:No SVHC (15-Jan-2019) RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Silicone Heat Transfer Compound, 495Ml; Dispensing Method Mg Chemicals - 61AC5491 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Silicone Heat Transfer Compound, 495Ml; Dispensing Method Mg Chemicals
61AC5491
Silicone Heat Transfer Compound, 495Ml; Dispensing Method Mg Chemicals 61AC5491
SILICONE HEAT TRANSFER COMPOUND, 495ML; Dispensing Method:Jar; Volume:495ml; Weight:-; Product Range:846 Series; SVHC:No SVHC (15-Jan-2019) RoHS Compliant: Yes

SILICONE HEAT TRANSFER COMPOUND, 495ML; Dispensing Method:Jar; Volume:495ml; Weight:-; Product Range:846 Series; SVHC:No SVHC (15-Jan-2019) RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 61AC5491
Product Name Silicone Heat Transfer Compound, 495Ml; Dispensing Method Mg Chemicals
Unlock Full Specs
to access all available technical data

Similar Products

Ripley™ - E 468-2-7-55F - ELANTAS North America LLC
ELANTAS North America LLC
Ripley™
E 468-2-7-55F
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
Thin Film, Very High Thermal Conductivity - SARCON ® YR-a - Fujipoly® America Corp.
Fujipoly® America Corp.
Thin Film, Very High Thermal Conductivity
SARCON ® YR-a
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Gap Fill 0.0118 to 0.0335 inch (0.3000 to 0.8500 mm)
Industry Electronics; Semiconductors, IC's
View Details
Formulations - Applications - Thermally Conductive - Dissipator 745 - 745PT - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive - Dissipator 745
745PT
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Heat Transfer Compound - SnapTrace® - Thermon, Inc
Thermon, Inc
Heat Transfer Compound
SnapTrace®
Specs
Form / Shape 4ft Lengths; Gap Filler, Foam in Place Gasket
Use Temperature 14 to 450 F (-10 to 232 C)
Thermal Conductivity 34.61 to 69.23 W/m-K (20 to 40 BTU-ft/hr-ft²-F)
View Details