MG Chemicals Silicone Heat Transfer Compound, 495Ml; Dispensing Method Mg Chemicals 846-1P

Description
SILICONE HEAT TRANSFER COMPOUND, 495ML; Dispensing Method:Jar; Volume:495ml; Weight:-; Product Range:846 Series; SVHC:No SVHC (15-Jan-2019) RoHS Compliant: Yes
Datasheet
Description
SILICONE HEAT TRANSFER COMPOUND, 495ML; Dispensing Method:Jar; Volume:495ml; Weight:-; Product Range:846 Series; SVHC:No SVHC (15-Jan-2019) RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Silicone Heat Transfer Compound, 495Ml; Dispensing Method Mg Chemicals - 61AC5491 - Newark, An Avnet Company
Chicago, IL, United States
Silicone Heat Transfer Compound, 495Ml; Dispensing Method Mg Chemicals
61AC5491
Silicone Heat Transfer Compound, 495Ml; Dispensing Method Mg Chemicals 61AC5491
SILICONE HEAT TRANSFER COMPOUND, 495ML; Dispensing Method:Jar; Volume:495ml; Weight:-; Product Range:846 Series; SVHC:No SVHC (15-Jan-2019) RoHS Compliant: Yes

SILICONE HEAT TRANSFER COMPOUND, 495ML; Dispensing Method:Jar; Volume:495ml; Weight:-; Product Range:846 Series; SVHC:No SVHC (15-Jan-2019) RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 61AC5491
Product Name Silicone Heat Transfer Compound, 495Ml; Dispensing Method Mg Chemicals
Unlock Full Specs
to access all available technical data

Similar Products

Two-component insulation thermal conductive gel for PCB - SE800AB - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Gel
Chemical System Silicone
Industry Electronics
View Details
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D - 746D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Chemical System Silicone
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Non-Drip, Polysulfide Based Two Component Adhesive - EP21TPND-NV - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Optional Premixed and Frozen; Grease, Paste; Gap Filler, Foam in Place Gasket
View Details
Thermal Pads - 655984 - RS Components, Ltd.
RS Components, Ltd.
Specs
Thermal Conductivity 1.5 W/m-K (0.8667 BTU-ft/hr-ft²-F)
View Details