MG Chemicals Silicone Heat Transfer Compound, 495Ml; Dispensing Method Mg Chemicals 846-1P

Description
SILICONE HEAT TRANSFER COMPOUND, 495ML; Dispensing Method:Jar; Volume:495ml; Weight:-; Product Range:846 Series; SVHC:No SVHC (15-Jan-2019) RoHS Compliant: Yes
  • Silicone Heat Transfer Compound, 495Ml; Dispensing Method Mg Chemicals - 61AC5491 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
SILICONE HEAT TRANSFER COMPOUND, 495ML; Dispensing Method:Jar; Volume:495ml; Weight:-; Product Range:846 Series; SVHC:No SVHC (15-Jan-2019) RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Silicone Heat Transfer Compound, 495Ml; Dispensing Method Mg Chemicals - 61AC5491 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Silicone Heat Transfer Compound, 495Ml; Dispensing Method Mg Chemicals
61AC5491
Silicone Heat Transfer Compound, 495Ml; Dispensing Method Mg Chemicals 61AC5491
SILICONE HEAT TRANSFER COMPOUND, 495ML; Dispensing Method:Jar; Volume:495ml; Weight:-; Product Range:846 Series; SVHC:No SVHC (15-Jan-2019) RoHS Compliant: Yes

SILICONE HEAT TRANSFER COMPOUND, 495ML; Dispensing Method:Jar; Volume:495ml; Weight:-; Product Range:846 Series; SVHC:No SVHC (15-Jan-2019) RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 61AC5491
Product Name Silicone Heat Transfer Compound, 495Ml; Dispensing Method Mg Chemicals
Unlock Full Specs
to access all available technical data

Similar Products

2-Part, Silicone Potting Compound and Encapsulant, UL Listed - QSil-563 - CHT USA Inc.
CHT USA Inc.
2-Part, Silicone Potting Compound and Encapsulant, UL Listed
QSil-563
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics
Features Flame Retardant; UL Rating
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D
745D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Silver Conductive, Fast Curing Epoxy Adhesive - EP77M-F - Master Bond, Inc.
Master Bond, Inc.
Silver Conductive, Fast Curing Epoxy Adhesive
EP77M-F
Specs
Cure / Technology Thermoset; Two Component  
Form / Shape Die Bonding Adhesives; Grease, Paste
Chemical System Epoxy
View Details