Matexcel Graphene Heat Dissipation Coating GRA-XT021

This product uses the high thermal conductivity and high emissivity of high-barrier graphene to transfer the heat from the surface of the high-temperature device into the coating, and radiate heat to the outside in the form of infrared rays, speeding up the heat exchange between the device and the outside world, reducing the surface and Internal temperature, so as to achieve the effect of improving the stability and service life of the device. Storage: Store at room Temperature. It contains organic solvents, keep well ventilated, avoid inhalation of excess vapor into the body, if it comes into contact with the skin, it should be cleaned with alcohol and hand sanitizer in time Application: 1. High power LED radiator 2. CPU cooler 3. Metal film for heat dissipation 4. Metal heat sink 5. Electrical cooling shell Usage: 1. Substrate treatment, remove dust and oil on the surface of the heat sink. 2. Mix according to the weight ratio; A component: B component = 6:1 (subject to the product manual), when mixing, pour B component into A component under the condition of continuous stirring to make it fully Stir well. After the mixed paint is matured for 10-20 minutes, filter it through a 100-200 mesh screen, and pour it into another container for later use. The mixed paint is valid for 5 hours, please use it according to the construction schedule. 3. Coating: The coating can be applied by brushing, dipping, spraying and other methods. 4. Dilution In general, paint does not need thinner, and it can be used to adjust viscosity and clean tools when the ambient temperature is too low. It is advisable to use supporting special thinner as the thinner of this coating. 5. After curing the coating, the device can be dried quickly by baking in an oven at 80 degrees for 30 minutes. 6. Precautions: There should be no opposing surfaces and opposing points between the coated device surfaces, so as to avoid mutual radiation between the surfaces of the objects and affect the heat dissipation and cooling of the device.