Materion Corporation Microelectronic Packaging Materials Ceramic Substrates

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Mayfield Heights, OH, USA
Microelectronic Packaging Materials
Ceramic Substrates
Microelectronic Packaging Materials Ceramic Substrates
Materion Microelectronics & Services offers metalized substrates developed from Beryllium Oxide (BeO) or alumina (Al2O3). The metallization can be thick film MoMn followed by plating, or direct bond copper (DBCu).

Materion Microelectronics & Services offers metalized substrates developed from Beryllium Oxide (BeO) or alumina (Al2O3). The metallization can be thick film MoMn followed by plating, or direct bond copper (DBCu).

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Technical Specifications

  Materion Corporation
Product Category Industrial Ceramic Materials
Product Number Ceramic Substrates
Product Name Microelectronic Packaging Materials
Material Type Alumina; Beryllia / Beryllium Oxide
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