Materion Microelectronics & Services offers metalized substrates developed from Beryllium Oxide (BeO) or alumina (Al2O3). The metallization can be thick film MoMn followed by plating, or direct bond copper (DBCu).
| Materion Corporation | |
|---|---|
| Product Category | Industrial Ceramic Materials |
| Product Number | Ceramic Substrates |
| Product Name | Microelectronic Packaging Materials |
| Material Type | Alumina; Beryllia / Beryllium Oxide |
