Master Bond EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring superb optical clarity as well as outstanding non-yellowing properties. This system has a forgiving mix ratio of 100 to 60 by weight. It will cure readily at 75°F in 3-5 days or 3-4 hours at 150-200°F. The optimum cure is overnight at room temperature followed by 3 hours at 150°F. EP21LSCL-1 has very low viscosity. It is also low exotherm, meaning it has a long working life and fits nicely when used for larger potting and encapsulation applications.
|Master Bond, Inc.|
|Product Category||Polymers and Plastic Resins|
|Product Name||Two Component, Epoxy Resin Systems|
|Viscosity||1000 to 1500 cP|
|Dielectric Strength||400 to 450 kV/in (157 to 177 kV/cm)|
|Tensile (Break)||7600 psi (52400 KPa)|