Master Bond EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring superb optical clarity as well as outstanding non-yellowing properties. This system has a forgiving mix ratio of 100 to 60 by weight. It will cure readily at 75°F in 3-5 days or 3-4 hours at 150-200°F. The optimum cure is overnight at room temperature followed by 3 hours at 150°F. EP21LSCL-1 has very low viscosity. It is also low exotherm, meaning it has a long working life and fits nicely when used for larger potting and encapsulation applications.
| Master Bond, Inc. | |
|---|---|
| Product Category | Polymers and Plastic Resins |
| Product Number | EP21LSCL-1 |
| Product Name | Two Component, Epoxy Resin Systems |
| Type | CastingResin; Thermally cured |
| Chemical System | Epoxy |
| Filler | Metal or MIM |
| Industry | Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Optoelectronics or Photonics; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working |
| Features | Anti-static or ESD Control; Thermally Conductive; Electrically Conductive Compound; EMI / RFI Shielding Material |
