Master Bond EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring superb optical clarity as well as outstanding non-yellowing properties. This system has a forgiving mix ratio of 100 to 60 by weight. It will cure readily at 75°F in 3-5 days or 3-4 hours at 150-200°F. The optimum cure is overnight at room temperature followed by 3 hours at 150°F. EP21LSCL-1 has very low viscosity. It is also low exotherm, meaning it has a long working life and fits nicely when used for larger potting and encapsulation applications.
| Master Bond, Inc. | |
|---|---|
| Product Category | Polymers and Plastic Resins |
| Product Number | EP21LSCL-1 |
| Product Name | Two Component, Epoxy Resin Systems |
| Viscosity | 1000 to 1500 cP |
| Resistivity | 1.00E12 ohm-cm |
| Dielectric Strength | 400 to 450 kV/in (157 to 177 kV/cm) |
| Transmission | 90 % |
| Tensile (Break) | 7600 psi (52400 KPa) |
