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EP21LVSP6 is a two component system that is also well suited for potting and encapsulation applications. It offers a very convenient one to one mix ratio, by weight or volume and is formulated to cure at room temperature. It has a desirable combination of a long open time of 3-5 hours, low mixed viscosity of 4,000-6,000 cps and excellent electrical insulation properties. Additionally it features a very low exotherm and can be used for casting deep cross-section thicknesses. EP21LVSP6 has superior physical strength and chemical/water resistant characteristics.
| Master Bond, Inc. | |
|---|---|
| Product Category | Insulating Varnishes and Impregnating Resins |
| Product Number | EP21LVSP6 |
| Product Name | Low Viscosity, Two Component Epoxy with Low Exotherm |
| Substrate Compatibility | Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer |
| Form / Shape | Liquid |
| Industry | Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; OEM or Industrial; Photonics; Semiconductors, IC's; Tooling |
| Chemical System | Epoxy |
| Cure / Technology | Room Temperature Vulcanizing or Curing; Thermoset |
