Marki Microwave LLC MQS-0209CH, MMIC 2-9GHz 90° Splitter / Combiner MQS-0209CH

Description
The MQS-0209 is a MMIC 2GHz - 9GHz 90° splitter/combiner. Wire bondable 50? terminations are available on-chip. Passive GaAs MMIC technology allows production of smaller constructions that replace larger form factor circuit board constructions. Tight fabrication tolerances allow for less unit to unit variation than traditional splitter/combiner technologies. The MQS-0209 is available as a wire bondable chip or connectorized module. Low variation allows for accurate simulations using the provided S4P file taken from measured production units.
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Description
The MQS-0209 is a MMIC 2GHz - 9GHz 90° splitter/combiner. Wire bondable 50? terminations are available on-chip. Passive GaAs MMIC technology allows production of smaller constructions that replace larger form factor circuit board constructions. Tight fabrication tolerances allow for less unit to unit variation than traditional splitter/combiner technologies. The MQS-0209 is available as a wire bondable chip or connectorized module. Low variation allows for accurate simulations using the provided S4P file taken from measured production units.
Request a Quote Datasheet

Suppliers

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Supplier Links
MQS-0209CH, MMIC 2-9GHz 90° Splitter / Combiner - MQS-0209CH - Marki Microwave LLC
Morgan Hill, CA, United States
MQS-0209CH, MMIC 2-9GHz 90° Splitter / Combiner
MQS-0209CH
MQS-0209CH, MMIC 2-9GHz 90° Splitter / Combiner MQS-0209CH
The MQS-0209 is a MMIC 2GHz - 9GHz 90° splitter/combiner. Wire bondable 50? terminations are available on-chip. Passive GaAs MMIC technology allows production of smaller constructions that replace larger form factor circuit board constructions. Tight fabrication tolerances allow for less unit to unit variation than traditional splitter/combiner technologies. The MQS-0209 is available as a wire bondable chip or connectorized module. Low variation allows for accurate simulations using the provided S4P file taken from measured production units.

The MQS-0209 is a MMIC 2GHz - 9GHz 90° splitter/combiner. Wire bondable 50? terminations are available on-chip. Passive GaAs MMIC technology allows production of smaller constructions that replace larger form factor circuit board constructions. Tight fabrication tolerances allow for less unit to unit variation than traditional splitter/combiner technologies. The MQS-0209 is available as a wire bondable chip or connectorized module. Low variation allows for accurate simulations using the provided S4P file taken from measured production units.

Supplier's Site Datasheet

Technical Specifications

  Marki Microwave LLC
Product Category RF Couplers
Product Number MQS-0209CH
Product Name MQS-0209CH, MMIC 2-9GHz 90° Splitter / Combiner
Frequency Range 2000.00 to 9000.00 MHz
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