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MACOM Binary Chip Capacitors

Description
MACOMs BOO and BSP Series Capacitors are designed to facilitate bread-boarding or to use where a trimming capability is required. These devices feature the same dielectric layer and bonding surfaces as our 9000 and 9100 Series chip capacitors. By connecting the pads in parallel, the capacitance values are add tive, so many combinations are possible. The BSP-1 chip offers the same capacitance values as BOO and BSP-3, but in a slightly larger chip with a more accommodating layout for ease of bonding.

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Description
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Binary Chip Capacitors -  - MACOM
Lowell, MA, USA
Binary Chip Capacitors
Binary Chip Capacitors
MACOMs BOO and BSP Series Capacitors are designed to facilitate bread-boarding or to use where a trimming capability is required. These devices feature the same dielectric layer and bonding surfaces as our 9000 and 9100 Series chip capacitors. By connecting the pads in parallel, the capacitance values are add tive, so many combinations are possible. The BSP-1 chip offers the same capacitance values as BOO and BSP-3, but in a slightly larger chip with a more accommodating layout for ease of bonding.

MACOMs BOO and BSP Series Capacitors are designed to facilitate bread-boarding or to use where a trimming capability is required. These devices feature the same dielectric layer and bonding surfaces as our 9000 and 9100 Series chip capacitors. By connecting the pads in parallel, the capacitance values are add tive, so many combinations are possible.

The BSP-1 chip offers the same capacitance values as BOO and BSP-3, but in a slightly larger chip with a more accommodating layout for ease of bonding.

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Technical Specifications

  MACOM
Product Category Capacitors
Product Name Binary Chip Capacitors
Configuration / Form Factor Chip Capacitor
Capacitance Type Variable
Electrolytic Capacitors Niobium / Niobium Oxide
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