M&I Materials Limited Vacuum Sealing Compound Apiezon Q Compound

Description
Apiezon Sealing Compound Q is a versatile, temporary vacuum sealing medium. It is a soft, putty like substance which is easily moulded by hand at ambient temperatures, yet firm enough to remain in position and is readily removed when no longer required.
Datasheet
Description
Apiezon Sealing Compound Q is a versatile, temporary vacuum sealing medium. It is a soft, putty like substance which is easily moulded by hand at ambient temperatures, yet firm enough to remain in position and is readily removed when no longer required.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Vacuum Sealing Compound - Apiezon Q Compound - M&I Materials Limited
Manchester, Greater Manchester, United Kingdom
Vacuum Sealing Compound
Apiezon Q Compound
Vacuum Sealing Compound Apiezon Q Compound
Apiezon Sealing Compound Q is a versatile, temporary vacuum sealing medium. It is a soft, putty like substance which is easily moulded by hand at ambient temperatures, yet firm enough to remain in position and is readily removed when no longer required.

Apiezon Sealing Compound Q is a versatile, temporary vacuum sealing medium. It is a soft, putty like substance which is easily moulded by hand at ambient temperatures, yet firm enough to remain in position and is readily removed when no longer required.

Supplier's Site Datasheet

Technical Specifications

  M&I Materials Limited
Product Category Industrial Sealants
Product Number Apiezon Q Compound
Product Name Vacuum Sealing Compound
Substrate Compatibility Ceramic, Glass; Metal; Plastic
Unlock Full Specs
to access all available technical data

Similar Products

Potting Compounds - 9184974 - RS Components, Ltd.
RS Components, Ltd.
Specs
Type / Form Liquid
Chemical System Epoxy
Features Encapsulant, Potting Compound
View Details
Epoxylite® - E 8121 Hi Temp Epoxy Kit - ELANTAS North America LLC
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Dissimilar Substrates
View Details
Heat Transfer Compound - SnapTrace® - Thermon, Inc
Specs
Features Gap Filler, Foam in Place Gasket; Thermally Conductive
Use Temperature 14 to 450 F (-10 to 232 C)
Thermal Conductivity 34.61 to 69.23 W/m-K (20 to 40 BTU-ft/hr-ft²-F)
View Details
KM 2740 Series -  - Beacon Adhesives, Inc.
Beacon Adhesives, Inc.
View Details