Littelfuse, Inc. Power Semiconductors & Control ICs - MOSFETs (Si/SiC) - N-Channel Super Junction - Series: C3-Class - IXKR25N80C IXKR25N80C

Description
These Power MOSFETs based on Super Junction technology feature the lowest RDS(on) in 600V-800V class MOSFETs. Internal DCB isolation simplifies assembly and reduces thermal resistance from junction to heat sink. These devices are Avalanche rated, thereby guaranteeing rugged operation. Advantages: Easy assembly Space savings High power density (1) CoolMOS™ is a trademark of Infineon Technologies AG. Silicon chip on Direct-Copper-Bond substrate 3rd generation CoolMOS™(1) power MOSFET Enhanced total power density Low thermal resistance
Description
These Power MOSFETs based on Super Junction technology feature the lowest RDS(on) in 600V-800V class MOSFETs. Internal DCB isolation simplifies assembly and reduces thermal resistance from junction to heat sink. These devices are Avalanche rated, thereby guaranteeing rugged operation. Advantages: Easy assembly Space savings High power density (1) CoolMOS™ is a trademark of Infineon Technologies AG. Silicon chip on Direct-Copper-Bond substrate 3rd generation CoolMOS™(1) power MOSFET Enhanced total power density Low thermal resistance
Datasheet
Datasheet Summary
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The IXKR25N80C is a third-generation CoolMOS™ N-channel enhancement mode MOSFET designed for high-efficiency switched-mode power supplies, uninterruptible power supplies, power factor correction, welding, and inductive heating. It is packaged in an ISOPLUS247™ case with an electrically isolated base, compatible with JEDEC TO-247AD, and weighs 6 g. The device has a drain-source voltage rating of 800 V, a continuous drain current of 25 A at 25°C, and a maximum on-resistance of 150 mΩ at 90°C. It features avalanche ruggedness with unclamped inductive switching energy of 0.67 mJ, a thermal resistance from junction to case of 0.5 K/W, and a coupling capacitance of 30 pF between pins and the mounting tab. The part meets JEDEC standards and is rated for junction temperatures up to 150°C and storage temperatures from -40°C to +125°C.

Datasheet Summary
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The IXKR25N80C is a third-generation CoolMOS™ N-channel enhancement mode MOSFET designed for high-efficiency switched-mode power supplies, uninterruptible power supplies, power factor correction, welding, and inductive heating. It is packaged in an ISOPLUS247™ case with an electrically isolated base, compatible with JEDEC TO-247AD, and weighs 6 g. The device has a drain-source voltage rating of 800 V, a continuous drain current of 25 A at 25°C, and a maximum on-resistance of 150 mΩ at 90°C. It features avalanche ruggedness with unclamped inductive switching energy of 0.67 mJ, a thermal resistance from junction to case of 0.5 K/W, and a coupling capacitance of 30 pF between pins and the mounting tab. The part meets JEDEC standards and is rated for junction temperatures up to 150°C and storage temperatures from -40°C to +125°C.

Suppliers

Company
Product
Description
Supplier Links
Power Semiconductors & Control ICs - MOSFETs (Si/SiC) - N-Channel Super Junction - Series: C3-Class - IXKR25N80C - IXKR25N80C - Littelfuse, Inc.
Rosemont, IL, United States
Power Semiconductors & Control ICs - MOSFETs (Si/SiC) - N-Channel Super Junction - Series: C3-Class - IXKR25N80C
IXKR25N80C
Power Semiconductors & Control ICs - MOSFETs (Si/SiC) - N-Channel Super Junction - Series: C3-Class - IXKR25N80C IXKR25N80C
These Power MOSFETs based on Super Junction technology feature the lowest RDS(on) in 600V-800V class MOSFETs. Internal DCB isolation simplifies assembly and reduces thermal resistance from junction to heat sink. These devices are Avalanche rated, thereby guaranteeing rugged operation. Advantages: Easy assembly Space savings High power density (1) CoolMOS™ is a trademark of Infineon Technologies AG. Silicon chip on Direct-Copper-Bond substrate 3rd generation CoolMOS™(1) power MOSFET Enhanced total power density Low thermal resistance

These Power MOSFETs based on Super Junction technology feature the lowest RDS(on) in 600V-800V class MOSFETs. Internal DCB isolation simplifies assembly and reduces thermal resistance from junction to heat sink. These devices are Avalanche rated, thereby guaranteeing rugged operation. Advantages: Easy assembly Space savings High power density (1) CoolMOS™ is a trademark of Infineon Technologies AG. Silicon chip on Direct-Copper-Bond substrate 3rd generation CoolMOS™(1) power MOSFET Enhanced total power density Low thermal resistance

Supplier's Site Datasheet
Mosfet, N, Isoplus247; Channel Type Ixys Semiconductor - 24M3048 - Newark, An Avnet Company
Chicago, IL, United States
Mosfet, N, Isoplus247; Channel Type Ixys Semiconductor
24M3048
Mosfet, N, Isoplus247; Channel Type Ixys Semiconductor 24M3048
MOSFET, N, ISOPLUS247; Channel Type:N Channel; Drain Source Voltage Vds:800V; Continuous Drain Current Id:25A; Transistor Mounting:Through Hole; Rds(on) Test Voltage:10V; Gate Source Threshold Voltage Max:4V; Power Dissipation:250W RoHS Compliant: Yes

MOSFET, N, ISOPLUS247; Channel Type:N Channel; Drain Source Voltage Vds:800V; Continuous Drain Current Id:25A; Transistor Mounting:Through Hole; Rds(on) Test Voltage:10V; Gate Source Threshold Voltage Max:4V; Power Dissipation:250W RoHS Compliant: Yes

Supplier's Site

Technical Specifications

  Littelfuse, Inc. Newark, An Avnet Company
Product Category Transistors Metal-Oxide Semiconductor FET (MOSFET)
Product Number IXKR25N80C 24M3048
Product Name Power Semiconductors & Control ICs - MOSFETs (Si/SiC) - N-Channel Super Junction - Series: C3-Class - IXKR25N80C Mosfet, N, Isoplus247; Channel Type Ixys Semiconductor
Polarity N-Channel
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