Laird Technologies Pads, Sheets, Bridges A18443-05

Description
THERM PAD 457.2X457.2MM GRAY
  • Pads, Sheets, Bridges - 926-A18443-05-ND - DigiKey
    DigiKey
Request a Quote Datasheet
Description
THERM PAD 457.2X457.2MM GRAY
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Pads, Sheets, Bridges - 926-A18443-05-ND - DigiKey
DigiKey
Thief River Falls, MN, United States
Pads, Sheets, Bridges
926-A18443-05-ND
Pads, Sheets, Bridges 926-A18443-05-ND
THERM PAD 457.2X457.2MM GRAY

THERM PAD 457.2X457.2MM GRAY

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Leveling and Filling Compounds
Product Number 926-A18443-05-ND
Product Name Pads, Sheets, Bridges
Thermal Conductivity 7.5 W/m-K (4.33 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Underfill Materials for Printed Circuit Boards (PCBs) - ALPHA ® HiTech ® CU31-3300 - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Underfill Materials for Printed Circuit Boards (PCBs)
ALPHA ® HiTech ® CU31-3300
Specs
Industry Electronics
Elongation 10.1 %
Dielectric Strength 635 kV/in (250 kV/cm)
View Details
One Component, High Viscosity UV Curable Polymer - UV11-3 - Master Bond, Inc.
Master Bond, Inc.
One Component, High Viscosity UV Curable Polymer
UV11-3
Specs
Cure / Technology Thermoset; Single Component
Type / Form Liquid
Features Adhesive; Flexible; High Dielectric; Non-corrosive; Sealant; Thermal Insulation
View Details
Fillers & Putties - 4479719 - RS Components, Ltd.
RS Components, Ltd.
Fillers & Putties
4479719
Specs
Type / Form Liquid
Features Sealant
Use Temperature 122 F (50 C)
View Details
Thermal Interface Materials - BERGQUIST SIL PAD TSP PPK1300 - Henkel Corporation - Industrial
Henkel Corporation - Industrial
Thermal Interface Materials
BERGQUIST SIL PAD TSP PPK1300
Specs
Use Temperature 68 to 302 F (20 to 150 C)
Thermal Conductivity 1.3 W/m-K (0.7511 BTU-ft/hr-ft²-F)
Dielectric Constant 0.0037
View Details