Laird Technologies Thermal Joint Compound, Cartridge, 300Cc Rohs Compliant Laird A18440-07

Description
THERMAL JOINT COMPOUND, CARTRIDGE, 300CC ROHS COMPLIANT: YES
Description
THERMAL JOINT COMPOUND, CARTRIDGE, 300CC ROHS COMPLIANT: YES

Suppliers

Company
Product
Description
Supplier Links
Thermal Joint Compound, Cartridge, 300Cc Rohs Compliant Laird - 34AK4273 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Joint Compound, Cartridge, 300Cc Rohs Compliant Laird
34AK4273
Thermal Joint Compound, Cartridge, 300Cc Rohs Compliant Laird 34AK4273
THERMAL JOINT COMPOUND, CARTRIDGE, 300CC ROHS COMPLIANT: YES

THERMAL JOINT COMPOUND, CARTRIDGE, 300CC ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 34AK4273
Product Name Thermal Joint Compound, Cartridge, 300Cc Rohs Compliant Laird
Unlock Full Specs
to access all available technical data

Similar Products

High performance silicone thermal conductive pad - SF600 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
Thin Film, High Thermal Conductivity - SARCON ® HR - Fujipoly® America Corp.
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Gap Fill 0.0118 to 0.0335 inch (0.3000 to 0.8500 mm)
Industry Electronics; Semiconductors, IC's
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Ripley™ - E 468-2-7-55F - ELANTAS North America LLC
ELANTAS North America LLC
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details