Laird Technologies Pads, Sheets, Bridges A17653-02

Description
Thermal Pad Pink 228.60mm x 228.60mm Square Tacky - Both Sides
  • Pads, Sheets, Bridges - 926-1591-ND - DigiKey
    DigiKey
  • Thermal Gap Filler, Silicone, 5W/m.k Rohs Compliant Laird - 58AJ9534 - Newark, An Avnet Company
    Newark, An Avnet Company
Request a Quote Datasheet
Description
Thermal Pad Pink 228.60mm x 228.60mm Square Tacky - Both Sides
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Pads, Sheets, Bridges - 926-1591-ND - DigiKey
DigiKey
Thief River Falls, MN, United States
Pads, Sheets, Bridges
926-1591-ND
Pads, Sheets, Bridges 926-1591-ND
Thermal Pad Pink 228.60mm x 228.60mm Square Tacky - Both Sides

Thermal Pad Pink 228.60mm x 228.60mm Square Tacky - Both Sides

Buy Now Datasheet
Thermal Gap Filler, Silicone, 5W/m.k Rohs Compliant Laird - 58AJ9534 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Gap Filler, Silicone, 5W/m.k Rohs Compliant Laird
58AJ9534
Thermal Gap Filler, Silicone, 5W/m.k Rohs Compliant Laird 58AJ9534
THERMAL GAP FILLER, SILICONE, 5W/M.K ROHS COMPLIANT: YES

THERMAL GAP FILLER, SILICONE, 5W/M.K ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  DigiKey Newark, An Avnet Company
Product Category Leveling and Filling Compounds Thermal Compounds and Thermal Interface Materials
Product Number 926-1591-ND 58AJ9534
Product Name Pads, Sheets, Bridges Thermal Gap Filler, Silicone, 5W/m.k Rohs Compliant Laird
Thermal Conductivity 5 W/m-K (2.89 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - SnapTrace® - Thermon, Inc
Thermon, Inc
Heat Transfer Compound
SnapTrace®
Specs
Form / Shape 4ft Lengths; Gap Filler, Foam in Place Gasket
Use Temperature 14 to 450 F (-10 to 232 C)
Thermal Conductivity 34.61 to 69.23 W/m-K (20 to 40 BTU-ft/hr-ft²-F)
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D
745D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
High thermal conductivity carbon fiber heat sink soft thermal pad thermal gap filler for electronic devices - CSF30 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
High thermal conductivity carbon fiber heat sink soft thermal pad thermal gap filler for electronic devices
CSF30
Specs
Form / Shape Pad
Industry Electronics
Use Temperature ? to 320 F (? to 160 C)
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details