Laird Technologies Pads, Sheets, Bridges A16367-42

Description
Thermal Pad Pink 228.60mm x 228.60mm Square
  • Pads, Sheets, Bridges - A16367-42-ND - DigiKey
    DigiKey
  • Thermal Gap Filler, 229 X 229Mm, 0.5Mm; Thermal Conductivity Laird - 52Y0876 - Newark, An Avnet Company
    Newark, An Avnet Company
Request a Quote Datasheet
Description
Thermal Pad Pink 228.60mm x 228.60mm Square
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Pads, Sheets, Bridges - A16367-42-ND - DigiKey
DigiKey
Thief River Falls, MN, United States
Pads, Sheets, Bridges
A16367-42-ND
Pads, Sheets, Bridges A16367-42-ND
Thermal Pad Pink 228.60mm x 228.60mm Square

Thermal Pad Pink 228.60mm x 228.60mm Square

Buy Now Datasheet
Thermal Gap Filler, 229 X 229Mm, 0.5Mm; Thermal Conductivity Laird - 52Y0876 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Gap Filler, 229 X 229Mm, 0.5Mm; Thermal Conductivity Laird
52Y0876
Thermal Gap Filler, 229 X 229Mm, 0.5Mm; Thermal Conductivity Laird 52Y0876
THERMAL GAP FILLER, 229 X 229MM, 0.5MM; Thermal Conductivity:2.8W/m. K; Conductive Material:Boron Nitride Filled; Thickness:0.5mm; Thermal Impedance:-; Dielectric Strength:-; External Length:229mm; Product Range:Tflex HR600 Series; RoHS Compliant: Yes

THERMAL GAP FILLER, 229 X 229MM, 0.5MM; Thermal Conductivity:2.8W/m.K; Conductive Material:Boron Nitride Filled; Thickness:0.5mm; Thermal Impedance:-; Dielectric Strength:-; External Length:229mm; Product Range:Tflex HR600 Series; RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  DigiKey Newark, An Avnet Company
Product Category Leveling and Filling Compounds Thermal Compounds and Thermal Interface Materials
Product Number A16367-42-ND 52Y0876
Product Name Pads, Sheets, Bridges Thermal Gap Filler, 229 X 229Mm, 0.5Mm; Thermal Conductivity Laird
Thermal Conductivity 3 W/m-K (1.73 BTU-ft/hr-ft²-F) 2.8 W/m-K (1.62 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

2-Part, Silicone Potting Compound and Encapsulant, UL Listed - QSil-563 - CHT USA Inc.
CHT USA Inc.
2-Part, Silicone Potting Compound and Encapsulant, UL Listed
QSil-563
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics
Features Flame Retardant; UL Rating
View Details
Thermally Conductive, Low Outgassing Epoxy - EP30AN-1 - Master Bond, Inc.
Master Bond, Inc.
Thermally Conductive, Low Outgassing Epoxy
EP30AN-1
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
View Details
PCM phase change material for communications equipment and wireless stations - SP350P - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
PCM phase change material for communications equipment and wireless stations
SP350P
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -40 to 257 F (-40 to 125 C)
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details