Laird Technologies Pads, Sheets, Bridges A16367-42

Description
Thermal Pad Pink 228.60mm x 228.60mm Square
Request a Quote Datasheet
Description
Thermal Pad Pink 228.60mm x 228.60mm Square
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Pads, Sheets, Bridges - A16367-42-ND - DigiKey
Thief River Falls, MN, United States
Pads, Sheets, Bridges
A16367-42-ND
Pads, Sheets, Bridges A16367-42-ND
Thermal Pad Pink 228.60mm x 228.60mm Square

Thermal Pad Pink 228.60mm x 228.60mm Square

Buy Now Datasheet
Thermal Gap Filler, 229 X 229Mm, 0.5Mm; Thermal Conductivity Laird - 52Y0876 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Gap Filler, 229 X 229Mm, 0.5Mm; Thermal Conductivity Laird
52Y0876
Thermal Gap Filler, 229 X 229Mm, 0.5Mm; Thermal Conductivity Laird 52Y0876
THERMAL GAP FILLER, 229 X 229MM, 0.5MM; Thermal Conductivity:2.8W/m. K; Conductive Material:Boron Nitride Filled; Thickness:0.5mm; Thermal Impedance:-; Dielectric Strength:-; External Length:229mm; Product Range:Tflex HR600 Series; RoHS Compliant: Yes

THERMAL GAP FILLER, 229 X 229MM, 0.5MM; Thermal Conductivity:2.8W/m.K; Conductive Material:Boron Nitride Filled; Thickness:0.5mm; Thermal Impedance:-; Dielectric Strength:-; External Length:229mm; Product Range:Tflex HR600 Series; RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  DigiKey Newark, An Avnet Company
Product Category Leveling and Filling Compounds Thermal Compounds and Thermal Interface Materials
Product Number A16367-42-ND 52Y0876
Product Name Pads, Sheets, Bridges Thermal Gap Filler, 229 X 229Mm, 0.5Mm; Thermal Conductivity Laird
Thermal Conductivity 3 W/m-K (1.73 BTU-ft/hr-ft²-F) 2.8 W/m-K (1.62 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Highly Conformable and Non-Flammable, Higher Thermal interface material - SARCON® PG80B - Fujipoly® America Corp.
Specs
Type High Dielectric
Form / Shape Putty; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
View Details
Ripley™ - E 468-2-7-55F - ELANTAS North America LLC
ELANTAS North America LLC
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details