Laird Technologies Pads, Sheets, Bridges A16367-13

Description
Thermal Pad Pink 228.60mm x 228.60mm Square
  • Pads, Sheets, Bridges - A16367-13-ND - DigiKey
    DigiKey
Request a Quote Datasheet
Description
Thermal Pad Pink 228.60mm x 228.60mm Square
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Pads, Sheets, Bridges - A16367-13-ND - DigiKey
DigiKey
Thief River Falls, MN, United States
Pads, Sheets, Bridges
A16367-13-ND
Pads, Sheets, Bridges A16367-13-ND
Thermal Pad Pink 228.60mm x 228.60mm Square

Thermal Pad Pink 228.60mm x 228.60mm Square

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Leveling and Filling Compounds
Product Number A16367-13-ND
Product Name Pads, Sheets, Bridges
Thermal Conductivity 3 W/m-K (1.73 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Liquid Gap Fillers for Electronics - Electrolube ® LGF400 Liquid Gap Filler - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Liquid Gap Fillers for Electronics
Electrolube ® LGF400 Liquid Gap Filler
Specs
Cure / Technology Two Component  
Type / Form Liquid
Features Sealant
View Details
One Component, Snap Cure, High Strength Epoxy - EP3SP5FL - Master Bond, Inc.
Master Bond, Inc.
One Component, Snap Cure, High Strength Epoxy
EP3SP5FL
Specs
Cure / Technology Thermoset; Single Component
Chemical System Epoxy
Composition Unfilled
View Details
Fillers & Putties - 4479719 - RS Components, Ltd.
RS Components, Ltd.
Fillers & Putties
4479719
Specs
Type / Form Liquid
Features Sealant
Use Temperature 122 F (50 C)
View Details
Thermal Interface Materials - BERGQUIST SIL PAD TSP 1500 - Henkel Corporation - Industrial
Henkel Corporation - Industrial
Thermal Interface Materials
BERGQUIST SIL PAD TSP 1500
Specs
Use Temperature 76 to 392 F (24 to 200 C)
Thermal Conductivity 0.2000 W/m-K (0.1156 BTU-ft/hr-ft²-F)
View Details