Laird Technologies Pads, Sheets, Bridges A15328-01

Description
Thermal Pad Green 228.60mm x 228.60mm Square
Request a Quote Datasheet
Description
Thermal Pad Green 228.60mm x 228.60mm Square
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Pads, Sheets, Bridges - 926-1534-ND - DigiKey
Thief River Falls, MN, United States
Pads, Sheets, Bridges
926-1534-ND
Pads, Sheets, Bridges 926-1534-ND
Thermal Pad Green 228.60mm x 228.60mm Square

Thermal Pad Green 228.60mm x 228.60mm Square

Buy Now Datasheet
Thermal Gap Filler, 229 X 229Mm, 2Mm; Thermal Conductivity Laird - 52Y0858 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Gap Filler, 229 X 229Mm, 2Mm; Thermal Conductivity Laird
52Y0858
Thermal Gap Filler, 229 X 229Mm, 2Mm; Thermal Conductivity Laird 52Y0858
THERMAL GAP FILLER, 229 X 229MM, 2MM; Thermal Conductivity:1.2W/m. K; Conductive Material:Silicone Elastomer; Thickness:2mm; Thermal Impedance:-; Dielectric Strength:-; External Length:229mm; External Width:229mm; Product Range:Tflex RoHS Compliant: Yes

THERMAL GAP FILLER, 229 X 229MM, 2MM; Thermal Conductivity:1.2W/m.K; Conductive Material:Silicone Elastomer; Thickness:2mm; Thermal Impedance:-; Dielectric Strength:-; External Length:229mm; External Width:229mm; Product Range:Tflex RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  DigiKey Newark, An Avnet Company
Product Category Leveling and Filling Compounds Thermal Compounds and Thermal Interface Materials
Product Number 926-1534-ND 52Y0858
Product Name Pads, Sheets, Bridges Thermal Gap Filler, 229 X 229Mm, 2Mm; Thermal Conductivity Laird
Thermal Conductivity 1.2 W/m-K (0.6933 BTU-ft/hr-ft²-F) 1.2 W/m-K (0.6933 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Highly Conformable and Non-Flammable, Higher Thermal interface material - SARCON® PG80B - Fujipoly® America Corp.
Specs
Type High Dielectric
Form / Shape Putty; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
View Details
2-Part, Silicone Potting Compound and Encapsulant, UL Listed - QSil-563 - CHT USA Inc.
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics
Features Flame Retardant; UL Rating
View Details
Heat Transfer Compound - SnapTrace® - Thermon, Inc
Specs
Form / Shape 4ft Lengths; Gap Filler, Foam in Place Gasket
Use Temperature 14 to 450 F (-10 to 232 C)
Thermal Conductivity 34.61 to 69.23 W/m-K (20 to 40 BTU-ft/hr-ft²-F)
View Details